Electrochemical Study on Enhanced Corrosion Resistance of Titanium Nitride Films Prepared by Ion Mixing and Vapor Deposition Method
Electrochemical Study on Enhanced Corrosion Resistance of Titanium Nitride Films Prepared by Ion Mixing and Vapor Deposition Method
批准号:
10650095
负责人:
UCHIDA Hitoshi
金额:
$1.47万
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
1998
资助国家:
日本
项目状态:
已结题
起止时间:
1998 至 1999
中文摘要
TiN薄膜是由干燥涂层工艺制成的,作为物理气相沉积展示,具有超强的磨损和良好的抗腐蚀能力,而其外观更具有吸引力的金色样颜色。涂层耐腐蚀性电影中最重要的点将导致没有微观缺陷,因为电影的腐蚀开始形成一个缺陷的部分,就像一个穿孔的针孔。如果要最小化TiN薄膜中的针孔缺陷密度,则过程参数必须是明确控制的,并且针孔缺陷缺陷的快速和定量评估方法必须是开发的。意外地,临界被动电流密度(CPCD)方法使金属表面区域的临界被动电流密度的事实得以利用,以显示金属表面区域中的主动被动转换变量。当涂层被应用于金属基底的这一部分时,渗透针孔底部的金属部分也被应用于活性潜力区域范围内的活性溶解。T(T) ... More Hus the Intensity of the measured critical passivation current density,就成了在Pinhole底部暴露的基底区域的可能性。因此,在本研究中,电子化学CPCD方法被用于定量地评价TiN涂层的无钢的针孔缺陷区域,用离子混合和蒸汽沉积方法制备离子混合和蒸汽沉积机的性能被研究从蒸发、离子束、基底温度和薄膜厚度的方面,以及TiN薄膜准备成功地通过SEM、XRD、AES和XPS方法。TiN电影是同源的,并且具有典型的金色颜色。他们展示了与首选方向相关的柱子结构,并包含更多或更少的针孔缺陷。在这里,对针孔变形的电化学评估被聚焦在沉积在不锈钢上的TiN薄膜上。在TiN films prepared at normal temperature of substrate decreased with increasing film thickness。Above 1.5 μm in thick films, however, there was an increasing tendency in the IイD2 critイD2 with cracking and/or peeling。在另一方面,我在300 ° C的TiN电影中准备好了一个TiN电影D2,考虑减少,增加了电影的厚度,并通过TiN涂层改进了由此产生的腐蚀抵抗力。针孔变形的区域比率被评估为I-D2 CRIT-D2的比率,即,D-2的涂层和非涂层标本,根据CPCD方法。它被证明是这样一种电化学测量是至高无上的,因为它是一种评估方法,用于校正耐腐蚀涂层薄膜的针孔变形。Less(低)
英文摘要
TiN films prepared by dry coating process such as physical vapor deposition exhibit superior wear and good corrosion resistance, and furthermore their appearance is attractive gold-like color. The most important point in coating corrosion-resistant films is to make no micro-defects because the corrosion of film starts form a defective part such as a perforating pinhole. In order to minimize pinhole defect density in a TiN film, the process parameters must be adequately controlled, and a quick and quantitative evaluation method of pinhole defect must be developed. Incidentally, the critical passivation current density (CPCD) method makes use of the fact that the critical passivation current density of metals exhibiting active-passive transition varies in proportion to the metal surface area. When a coating is applied over this sort of metal substrate, the metal part at the bottom of the perforating pinhole is subjected to active dissolution in the range of the active potential region. T … More hus the intensity of the measured critical passivation current density, becomes proportional to the exposed substrate area at the bottom of pinholes. In this study, therefore, the electrochemical CPCD method was used to quantitatively evaluate the pinhole defect area for the TiN-coated stainless steels prepared by ion mixing and vapor deposition method.The performance of ion mixing and vapor deposition machine used was studied from the aspect of evaculation, ion beam, substrate temperature and film thickness, and the TiN film prepared was evaluated successfully by SEM, XRD, AES and XPS methods. The TiN films were homogeneous and with the characteristic gold-like color. They exhibited the columnar structure with the preferential orientations, and contained more or less pinhole defects. Here, the electrochemical evaluation of pinhole defects is focused on the TiN films deposited onto stainless steels. The critical passivation current density IィイD2critィエD2 in the TiN films prepared at normal temperature of substrate decreased with increasing film thickness. Above1.5μm in thick films, however, there was an increasing tendency in the IィイD2critィエD2 with cracking and/or peeling. On the other hand, the IィイD2critィエD2 in the TiN films prepared at 300℃ decreased considerably with increasing film thickness, and the resulting corrosion resistance was improved by TiN-coating. The area ratio of pinhole defects was evaluated by the ratio of IィイD2critィエD2 of a coated and a non-coated specimens, i.e., by CPCD method. It is demonstrated that such electrochemical measurement is superior as an evaluation method for the pinhole defects of corrosion-resistive coating films. Less
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H. UCHIDA, M. YAMASHITA: "Electrochemical Defect Evalution of TiN Films Prepared by Dry Coating Process"Proc. 14th Int. Corrosion Congress. Vol. 2. 163/1-163/5 (1999)
H. UCHIDA、M. YAMASHITA:“干式涂层工艺制备的 TiN 薄膜的电化学缺陷评估”Proc。
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内田 仁,山下正人: "イオンミキシング蒸着装置の特性とその応用"プラズマ応用と複合機能材料. Vol. 8. 97-100 (1999)
Hitoshi Uchida、Masato Yamashita:“离子混合气相沉积设备的特性及其应用”等离子应用和复合功能材料,第 8 卷,97-100 (1999)。
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Hitoshi UCHIDA: "Performance of Ion Mixing and Vapor Deposition Machine and Its Application"Plasma Application & Hybrid Functionally Materials. 8. 97-100 (1999)
内田仁:《离子混合蒸镀机的性能及其应用》等离子应用
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内田 仁、山下正人: "イオンミキシング蒸着装置の特性とその応用" プラズマ応用と複合機能材料. Vol.8,Mar.97-100 (1999)
Hitoshi Uchida、Masato Yamashita:“离子混合气相沉积设备的特性及其应用”等离子应用和复合功能材料。第8卷,Mar.97-100(1999)。
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Hitoshi UCHIDA: "Electrochemical Defect Evalution of TiN Films Prepared by Dry Coating Process"Proc.14th Int.Corrosion Congress. 2. 163/1-5 (1999)
Hitoshi UCHIDA:“干涂工艺制备的 TiN 薄膜的电化学缺陷评估”第 14 届国际腐蚀大会议程。
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