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Electrochemical Study on Enhanced Corrosion Resistance of Titanium Nitride Films Prepared by Ion Mixing and Vapor Deposition Method

离子混合气相沉积法制备氮化钛薄膜增强耐蚀性能的电化学研究

基本信息

批准号：
10650095
负责人：
UCHIDA Hitoshi
金额：
$ 1.47万
依托单位：
Himeji Institute of Technology
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
1998
资助国家：
日本
起止时间：
1998 至 1999
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-10650095/
关键词：
Titanium nitride film Ion Mixing and Vapor Deposition Pinhole defect Anodic polarization curve

项目摘要

TiN films prepared by dry coating process such as physical vapor deposition exhibit superior wear and good corrosion resistance, and furthermore their appearance is attractive gold-like color. The most important point in coating corrosion-resistant films is to make no micro-defects because the corrosion of film starts form a defective part such as a perforating pinhole. In order to minimize pinhole defect density in a TiN film, the process parameters must be adequately controlled, and a quick and quantitative evaluation method of pinhole defect must be developed. Incidentally, the critical passivation current density (CPCD) method makes use of the fact that the critical passivation current density of metals exhibiting active-passive transition varies in proportion to the metal surface area. When a coating is applied over this sort of metal substrate, the metal part at the bottom of the perforating pinhole is subjected to active dissolution in the range of the active potential region. T … More hus the intensity of the measured critical passivation current density, becomes proportional to the exposed substrate area at the bottom of pinholes. In this study, therefore, the electrochemical CPCD method was used to quantitatively evaluate the pinhole defect area for the TiN-coated stainless steels prepared by ion mixing and vapor deposition method.The performance of ion mixing and vapor deposition machine used was studied from the aspect of evaculation, ion beam, substrate temperature and film thickness, and the TiN film prepared was evaluated successfully by SEM, XRD, AES and XPS methods. The TiN films were homogeneous and with the characteristic gold-like color. They exhibited the columnar structure with the preferential orientations, and contained more or less pinhole defects. Here, the electrochemical evaluation of pinhole defects is focused on the TiN films deposited onto stainless steels. The critical passivation current density IィイD2critィエD2 in the TiN films prepared at normal temperature of substrate decreased with increasing film thickness. Above1.5μm in thick films, however, there was an increasing tendency in the IィイD2critィエD2 with cracking and/or peeling. On the other hand, the IィイD2critィエD2 in the TiN films prepared at 300℃ decreased considerably with increasing film thickness, and the resulting corrosion resistance was improved by TiN-coating. The area ratio of pinhole defects was evaluated by the ratio of IィイD2critィエD2 of a coated and a non-coated specimens, i.e., by CPCD method. It is demonstrated that such electrochemical measurement is superior as an evaluation method for the pinhole defects of corrosion-resistive coating films. Less

采用物理气相沉积等干法镀膜方法制备的TiN薄膜具有优异的耐磨性和耐腐蚀性，且外观呈金黄色。涂层耐蚀涂层最重要的一点是不产生微小缺陷，因为涂层的腐蚀开始形成一个缺陷部分，如穿孔针孔。为了使TiN薄膜中的针孔缺陷密度最小，必须充分控制工艺参数，并开发一种快速、定量的针孔缺陷评估方法。顺便提一句，临界钝化电流密度(CPCD)方法利用了呈现主动-被动转变的金属的临界钝化电流密度与金属表面积成比例变化的事实。当在这种金属衬底上涂覆涂层时，穿孔针孔底部的金属部分在有源电位区范围内受到活性溶解。T…测得的临界钝化电流密度的强度与针孔底部裸露的衬底面积成正比。因此，本研究采用电化学CPCD方法对离子混合气相沉积法制备的TiN涂层不锈钢的针孔缺陷区域进行了定量评价。从离子混合和气相沉积设备的排气、离子束、衬底温度和薄膜厚度等方面研究了离子混合气相沉积设备的性能，并用扫描电子显微镜、X射线衍射仪、俄歇电子能谱和X射线光电子能谱等方法对所制备的TiN薄膜进行了评价。TiN薄膜均匀，具有典型的金黄色。它们具有择优取向的柱状结构，并含有或多或少的针孔缺陷。在这里，针孔缺陷的电化学评价主要集中在沉积在不锈钢上的TiN膜上。在基片常温下制备的TiN薄膜的临界钝化电流密度IィイD2critィエD2随薄膜厚度的增加而减小。在1.5μm厚膜中，IィイD2critィエD2有破裂和/或剥落的趋势。另一方面，随着TiN膜厚度的增加，TiN膜中IィイD2critィエD2的含量显著降低，且TiN涂层的耐蚀性有所提高。通过涂层和未涂层试件的IィイD2critィエD2之比，即CPCD法，评估针孔缺陷的面积比。结果表明，这种电化学测试方法是评价耐腐蚀涂层针孔缺陷的一种较好的方法。较少