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Semiconductor coupled SAW device

半导体耦合声表面波器件

基本信息

批准号：
11650356
负责人：
HOHKAWA Kohji
金额：
$ 2.62万
依托单位：
Kanagawa Institute of Technology
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
1999
资助国家：
日本
起止时间：
1999 至 2002
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-11650356/
关键词：
Surface Acoustic Wave Semiconductor Integrated Functional Device ELO film bonding distributed SAW device 分布乗数形素子

项目摘要

In this paper, we investigated SAW-semiconductor coupled integrated circuits, which have excellent characteristics compared to devices consisting of a simple combination of two kinds of devices. We have shown the following results.1) As the fabrication technology, we investigated Epitaxial-Lift-Off film bonding process for fabricating the SAW-semiconductor coupled integrated circuit and obtained following results : We have studied basic fabrication process ; higher speed and damage free semiconductor film peeling from its mother substrate, surface treatment for a tight bonding, clarification of bonding mechanism using X-ray topography, and some basic technologies for the way to the mass-productivity.2) Device technology : We studied the interaction between the electric field caused by the propagating SAW and carriers and potential field distribution in a semiconductor. Based on this study, we proposed new function devices such as optical signal controlled oscillator, a variable phase device, and etc. We also studied devices, which are useful for the functional devices for many kinds of high-speed wireless communication systems. We proposed a high performance convolver, variable correletor and verified theusefullness of these devices experimentally. We also proposed distributed semiconductor coupled analog processing SAW device, which will be useful in a future.

在本文中，我们研究了SAW半导体耦合集成电路，与由两种器件的简单组合组成的器件相比，它具有优异的特性。我们取得了以下成果： 1)作为制作技术，我们研究了外延剥离薄膜键合工艺来制作SAW-半导体耦合集成电路，并取得了以下成果：我们研究了基本的制作工艺；更高速且无损伤的半导体薄膜从母基板上剥离、紧密接合的表面处理、利用X射线形貌术阐明接合机制以及实现大规模生产的一些基本技术。2）器件技术：我们研究了传播SAW和载流子引起的电场之间的相互作用以及半导体中的势场分布。在此研究的基础上，我们提出了光信号控制振荡器、可变相位器件等新的功能器件。我们还研究了可用于多种高速无线通信系统的功能器件。我们提出了一种高性能卷积器、可变相关器，并通过实验验证了这些装置的实用性。我们还提出了分布式半导体耦合模拟处理 SAW 设备，这将在未来有用。