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Metal Deposition Process from Quaternary Ammonium Triflate-type Non-aluminate Room Temperature Molten Salts

三氟甲磺酸季铵型非铝酸盐室温熔盐金属沉积工艺

基本信息

批准号：
12650733
负责人：
HIRATO Tetsuji
金额：
$ 2.3万
依托单位：
KYOTO UNIVERSITY
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2000
资助国家：
日本
起止时间：
2000 至 2001
项目状态：
已结题

项目摘要

The redox and/or electrodeposition behaviors of copper, nickel, zinc, titanium, magnesium, and Cu-Mg alloy were examined using an "ammonium imide" room temperature molten salt as a novel electrolytic medium in order to clarify the applicability of the salt to the electrochemical process. Trimethyl-n-hexylammonium bis((trifluoromethyl)sulfonyl)amide (TMHA-Tf_2N), having an electrochemical window of 5.6 V (50 ℃), and metal salts were used to prepare the electrolyte. In TMHA-Tf_2N media monovalent copper ion, Cu(I), was stable and Cu metal was oxidized, or corroded, in the presence of Cu(II) species as : Cu^2+ + Cu → 2Cu^+. Cathodic electrodeposition of copper metal and its anodic dissolution were, thus, one-electron reactions and their current efficiencies were almost 100%.Nickel, zinc, and Cu-Mg alloy can also be electrodeposited from the TMHA-Tf_2N media at a certain potentiostatic condition. The nickel and zinc metals deposited appeared as a gray-colored film, while the magnesium was dendritic. In contrast, though the TMHA-Tf_2N salt containing titanium species gave the redox current of dissolving titanium species, titanium metal was not able to deposit electrochemically.The TMHA-Tf_2N salt containing both Cu^+ and Mg^<2+> ions, provided an Cu-Mg alloy containing about 23 at. % Mg. X-ray diffraction of the alloy gave a set of reflection due to elemental copper, suggesting that the magnesium formed a solid solution with copper.

研究了一种新型的“亚胺铵”室温熔盐作为电解介质对铜、镍、锌、钛、镁和Cu-Mg合金的氧化还原和/或电沉积行为，以阐明该盐在电化学过程中的适用性。采用电化学窗口为5.6V（50 ℃）的双（三氟甲基磺酰基）酰胺三甲基正己基铵（TMHA-Tf_2N）和金属盐制备电解质。在TMHA-Tf_2N介质中，一价铜离子Cu（I）是稳定的，Cu（II）以Cu^2+ + Cu → 2Cu^+形式存在时，金属Cu被氧化或腐蚀。结果表明，金属铜的阴极电沉积和阳极溶解均为单电子反应，电流效率接近100%，在一定的恒电位条件下，TMHA-Tf_2N体系还可以电沉积镍、锌和铜镁合金。沉积的镍和锌金属呈现为灰色膜，而镁为树枝状。相比之下，虽然含有钛物种的TMHA-Tf_2 N盐提供了溶解钛物种的氧化还原电流，但钛金属不能电化学存款。含有Cu^+和Mg^<2+>离子的TMHA-Tf_2 N盐提供了含有约23原子的Cu-Mg合金。%的Mg。合金的X射线衍射给出了一组由于元素铜的反射，表明镁与铜形成了固溶体。