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DEVELOPMENT OF ULTRAPRECISION CLEANING SYSTEM USING HIGH-VELOCITY SHEAR FLOW AND ELECTROCHEMICAL ETCHING PROCESS IN ULTRAPRE WATER

利用高速剪切流和超纯水中电化学蚀刻工艺开发超精密清洁系统

基本信息

批准号：
14205025
负责人：
GOTO Hidekazu
金额：
$ 29.04万
依托单位：
OSAKA UNIVERSITY
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (A)
财政年份：
2002
资助国家：
日本
起止时间：
2002 至 2003
项目状态：
已结题

项目摘要

A new method of ultraprecision cleaning process for removing the particle contamination using high-velocity shear flow of ultrapure water along the surface to be cleaned was proposed. We constructed a new experimental apparatus which can supply high-velocity shear flow of ultrapure water, and performed cleaning processes in ultrapure water of Si wafer surfaces which are pre-contaminated by silica particles whose diameters are 0.4〜7.0μm. Cleaning processes of amorphous Si, ITO (indium tin oxide), TIN and organic compound deposited on Si wafer were also performed. It was confirmed that perfect removal of contaminated particles on the substrates are possible. In addition, cleaning processes in the air were also conducted, and it was confirmed that the processes in the air are more effective than the one in the ultrapure water, since the processes in the air require smaller amount of ultrapure water than the ones in ultrapure water.As the second step, we proposed another new cleaning process for removing metal contaminations applying electrochemical etching process of metal induced by OH^-ions in ultrapure water. In order to increase the density of the OH^-ions in ultrapure water, we prototyped carboxylated graphite electrodes, since the carboxyl function has the ability of dissociation of the water molecules into H+ and OH^-ions. Applying the carboxylated graphite electrodes as cathodes and the substrates to be cleaned as anodes, electrolysis current induced by H+ and OH^-ions was observed, and Cu plate on the anode substrates was etched off. From these results, we concluded that our newly proposed cleaning processes are useful for perfect removal of contaminations of particles and metal on substrates.

提出了一种利用超纯水沿被清洗表面的高速剪切流动去除颗粒污染的超精密清洗新方法。建立了一套能提供超纯水高速剪切流的实验装置，对被直径为0.4~7.0μm的二氧化硅颗粒预污染的硅片表面在超纯水中进行了清洗，并对硅片上沉积的非晶态硅、氧化铟锡、TiN和有机化合物进行了清洗。已经证实，完全去除基质上的污染颗粒是可能的。此外，我们还进行了空气中的清洗过程，证实空气中的清洗过程比在超纯水中的清洗更有效，因为空气中的清洗过程比在超纯水中的清洗过程需要更少的超纯水。作为第二步，我们提出了另一种新的清洗工艺，利用超纯水中OH~-离子诱导的金属电化学刻蚀过程来去除金属污染物。为了提高超纯水中OH~-离子的密度，我们制作了羧化石墨电极，因为它具有将水分子解离为H~+和OH~+离子的能力。以羧化石墨电极为阴极，待清洗衬底为阳极，观察了H+和OH-离子诱导的电解电流，并对阳极衬底上的铜板进行了刻蚀。从这些结果中，我们得出结论，我们新提出的清洁工艺对于完美去除基材上的颗粒和金属污染物是有用的。

项目成果

期刊论文数量（15）

专著数量（0）

科研奖励数量（0）

会议论文数量（0）

专利数量（0）

Y.Mori, H.Goto, K.Hirose, Y.Toma, I.Kobata, A.Iwai: "A Study on Electrochemical Machining Method in Ultrapure Water -Development of Electrode for Dissociation of Water Molecules -"Autumn Meeting Abstracts of the Japan Society for Precision Engineering. 33

Y.Mori、H.Goto、K.Hirose、Y.Toma、I.Kobata、A.Iwai：“超纯水中电化学加工方法的研究-水分子解离电极的开发-”秋季会议摘要

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森勇藏, 広瀬喜久治, 後藤英和, 岩井章人, 一井愛雄, 當間康他: "超純水のみによる電気化学的加工法の研究-水分子を解離する機能を有する電極の開発-"精密工学会2003年度関西地方定期学術講演会講演論文集. 25-26 (2003)

Yuzo Mori、Kikuji Hirose、Hidekazu Goto、Akito Iwai、Aio Ichii、Yasushi Toma 等：“仅使用超纯水的电化学处理的研究 - 具有解离水分子功能的电极的开发 -” 2003 年关西地区会议论文集日本精密工程学会定期学术会议25-26（2003）。