Characterisation of soldered and adhesively bonded assemblies in photonic packages

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Photonic packaging plays key roles in development of new optical technology. The project aims to establish the theories and techniques for characterising the integrity of soldered and adhesively bonded assemblies for photonic packaging. The critical failure mechanisms will be investigated, and sophisticated life prediction models will be established using artificial neural network (ANN) approaches for reliability assessment. The outcomes of the project will fill the gap in the knowledge for characterising failure processes of these assemblies and provide effective methods and easy-to-use guidelines for reliability evaluation and life prediction of photonic packages, expanding and enhancing Australia's capacity in the areas.