Development of mechanically strong, ultrasonically processed, nanoparticle-embedded Pb-free soldered electronic interconnects and Al-Si brazed joints

开发机械强度高、超声波处理、纳米颗粒嵌入的无铅焊接电子互连件和铝硅钎焊接头

• 批准号: LP140100485
• 负责人: Em/Prof David St John
• 金额: $ 24.94万
• 依托单位: The University of Queensland
• 依托单位国家: 澳大利亚
• 项目类别: Linkage Projects
• 财政年份: 2014
• 资助国家: 澳大利亚
• 起止时间: 2014-10-08 至 2019-12-24
• 项目状态: 已结题
• 来源: https://dataportal.arc.gov.au/RGS/Web/Grants/LP140100485
• 关键词: Development; mechanically; strong; ultrasonically; processed

This project aims to combine recent advances in understanding grain refinement during solidification with novel techniques of microstructure control through the application of external stimuli during processing and the addition of nanoparticle master alloys. This approach aims to enable the manufacture of fine-grained high performance products. The research is intended to be applied to soldering and brazing operations for improved behaviour during manufacturing and increased reliability. The involvement of a major global supplier of alloys to the electronics sector aims to facilitate the application of the research in the development of advanced products suitable for incorporation into next-generation electrical devices.

该项目旨在通过在加工过程中应用外部刺激和添加纳米颗粒师合金的外部刺激来结合了解凝固过程中谷物细化的最新进展。这种方法旨在使精细颗粒高性能产品的生产。该研究旨在应用于焊接和腌制操作，以改善制造过程中的行为并提高可靠性。全球合金供应商与电子部门的参与旨在促进研究在开发适合下一代电气设备中的高级产品中的开发中。