Low Temperature Bonding Process through Self-Sintering of Nanoparticles and its Application to Electronics Assembly

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A novel bonding process using Ag nanoparticles with a particle size less than several tens nm that realizes solid state metal-to-metal bonding at a bonding temperature of 300℃ or lower has been developed. In particular, we have devised a bonding process through in-situ formation of Ag nanoparticles by reducing Ag_2O microparticles that achieves successful metal-to-metal bonding at 200℃. This bonding process is also more convenient and lower cost, and allows higher bonding strength than that directly using Ag nanoparticles. We have applied this bonding process to assembly of a power semiconductor and achieved higher reliability than the conventional assembly by soldering.