A Low-Temperature Bonding Process Using Nanoparticles Derived from Reduction Reaction and Its Application to Micro Joining

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We have developed a low-temperature bonding process utilizing low-temperature sintering ability of nanoparticles derived from reducing metallic oxides, such as the silver oxide, by organic solvents. Gold, copper, nickel and aluminum can be bonded using this bonding process. Gold having no surface oxide layer has been directly bonded by sintered silver particles. In copper and nickel, bonding has been accomplished after reducing their natural oxides layers by the organic solvents during bonding process. Bonding of aluminum has been achieved through its natural oxide layer, which cannot be reduced by the organic solvents. Bondability of copper has been improved by applying a paste made by mixing the copper oxide with the silver oxide to an adequate ratio.