A Low-Temperature Bonding Process Using Nanoparticles Derived from Reduction Reaction and Its Application to Micro Joining

还原反应纳米粒子的低温键合工艺及其在微连接中的应用

• 批准号: 23360322
• 负责人: HIROSE Akio
• 金额: $ 11.48万
• 依托单位: Osaka University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 2011
• 资助国家: 日本
• 起止时间: 2011-04-01 至 2014-03-31
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-23360322/
• 关键词: 接合; ナノ材料; 界面制御; 焼結; 還元反応; 有機溶剤; 実装; 材料加工・処理; 高密度実装; 材料加工処理

We have developed a low-temperature bonding process utilizing low-temperature sintering ability of nanoparticles derived from reducing metallic oxides, such as the silver oxide, by organic solvents. Gold, copper, nickel and aluminum can be bonded using this bonding process. Gold having no surface oxide layer has been directly bonded by sintered silver particles. In copper and nickel, bonding has been accomplished after reducing their natural oxides layers by the organic solvents during bonding process. Bonding of aluminum has been achieved through its natural oxide layer, which cannot be reduced by the organic solvents. Bondability of copper has been improved by applying a paste made by mixing the copper oxide with the silver oxide to an adequate ratio.

我们开发了一种低温粘合工艺，该工艺利用了通过有机溶剂还原金属氧化物（例如氧化银）而获得的纳米颗粒的低温烧结能力。金、铜、镍和铝可以使用这种键合工艺键合。没有表面氧化层的金通过烧结的银颗粒直接结合。在铜和镍中，键合是在键合过程中用有机溶剂还原其自然氧化物层后完成的。铝的结合是通过其天然氧化层实现的，该氧化层不能被有机溶剂还原。通过涂敷通过将氧化铜与银氧化物以适当的比例混合而制成的糊剂，铜的可接合性得到改善。

项目成果

Effect of Silver Fineparticles on the Resistance Spot Welding of Pure Copper

银微粒对纯铜电阻点焊的影响

• 发表时间: 2013
• 作者: Yuichiro Suzuki;Tomo Ogura;Akio Hirose
• 通讯作者: Akio Hirose

Bondability of Joints Using Ag2O and CuO Combined Paste for Electronics Packaging

电子封装用 Ag2O 和 CuO 组合浆料的接合性能

• 发表时间: 2012
• 作者: 鈴木裕一郎;小椋智;廣瀬 明夫;鈴木 裕一郎;高田 慎也;高田慎也;A. Hirose;A. Hirose;S. Takata;Y. Suzuki;T. Ogura
• 通讯作者: T. Ogura

Interfacial Microstructure in Aluminum Bonding Using Silver Nanoparticles Derived from Silver Oxide

使用氧化银衍生的银纳米颗粒进行铝键合的界面微观结构

• 发表时间: 2012
• 作者: 鈴木裕一郎;小椋智;廣瀬 明夫;鈴木 裕一郎;高田 慎也;高田慎也;A. Hirose;A. Hirose;S. Takata;Y. Suzuki;T. Ogura;A. Hirose;T. Sano;T. Ogura;Y. Suzuki;S. Takata;S. Takata
• 通讯作者: S. Takata

Effect of Polyethylene Glycols with Different Polymer Chain Lengths on the Bonding Process Involving <i>In Situ</i> Formation of Silver Nanoparticles from Ag₂O

不同聚合物链长的聚乙二醇对Ag₂O<i>原位</i>形成银纳米粒子键合过程的影响

• DOI: 10.2320/matertrans.md201201
• 发表时间: 2013
• 期刊: MATERIALS TRANSACTIONS
• 影响因子: 1.2
• 作者: T. Yagishita;T. Ogura and A. Hirose
• 通讯作者: T. Ogura and A. Hirose

高温鉛基はんだ代替技術の動向（２）ナノテクノロジーを利用した低温焼結接合

替代高温铅基焊料的技术趋势（2）利用纳米技术的低温烧结接合

• 发表时间: 2012
• 期刊: 金属
• 作者: T. Ito;T. Ogura and A. Hirose;廣瀬明夫;廣瀬 明夫;廣瀬 明夫
• 通讯作者: 廣瀬 明夫