Three-Dimensionally Stacked Hetero-Chip Fabrication by Self-Assembly

自组装三维堆叠异质芯片制造

• 批准号: 19686022
• 负责人: FUKUSHIMA Takafumi
• 金额: $ 14.73万
• 依托单位: Tohoku University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Young Scientists (A)
• 财政年份: 2007
• 资助国家: 日本
• 起止时间: 2007 至 2009
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-19686022/
• 关键词: インターコネクト・パッケージのシステム化・応用; 自己組織化; マイクロ・ナノデバイス; 流体; 微細接続; システムオンチップ

We have provided new three-dimensional integration technology based on high-precision multi-chip self-assembly using surface tension of liquid droplets. We have successfully fabricated heterogeneous multi-chip test module using the self-assembly technology. The alignment accuracy was found to be within 1 micron, and more than 500 chips can be self-assembled on substrates in batch. In addition, the chips were tightly bonded to the substrates at room temperature without thermal compression.

我们提供了基于液滴表面张力的高精度多芯片自组装的新型三维集成技术。我们利用自组装技术成功制作了异构多芯片测试模块。对准精度在1微米以内，可以批量在基板上自组装500多个芯片。此外，芯片在室温下与基板紧密结合，无需热压缩。

项目成果

Low-Loss Optical Interposer with Recessed VerticalCavity SurfaceEmitting Laser Diode and Photodiode Chips into Si Substrate

低损耗光学内插器，将凹入式垂直腔表面发射激光二极管和光电二极管芯片集成到硅基板中

• 发表时间: 2008
• 期刊: Japanese Journal of Applied Physics 47
• 作者: Uchimura;T.;Towhata;I.;Wang.;L. and Seko;I.;D. Mori;Makoto iwara
• 通讯作者: Makoto iwara

Cu Filling Characteristics in Through-Si Via Holes by Electroless Plating with Addition of Inhibitors

添加抑制剂的化学镀硅通孔中的 Cu 填充特性

• 发表时间: 2009
• 期刊: ECS Transactions Vol.16
• 作者: F. Inoue;M. Koyanagi;T. Fukushima;K. Yamamoto;S. Tanaka;Z. wang;S. Shingubara
• 通讯作者: S. Shingubara

自己組織化機能を用いた三次元集積回路の製造方法及び製造装置

利用自组装功能的三维集成电路的制造方法及装置

• 发表时间: 2009

Three-dimensional integration technology based on reconfigured wafer-to-wafer and multichip-to-wafer stacking using self-assembly method

• DOI: 10.1109/iedm.2009.5424353
• 发表时间: 2009-12
• 期刊: 2009 IEEE International Electron Devices Meeting (IEDM)
• 作者: T. Fukushima;E. Iwata;Y. Ohara;A. Noriki;K. Inamura;Kang-wook Lee;J. Bea;Tetsu Tanaka;M. Koyanagi

Super Chip Integration Technology for ThreeDimensionally Stacked Retinal Prosthesis Chips

三维堆叠视网膜假体芯片的超级芯片集成技术

• 发表时间: 2009
• 作者: 山本悟;後藤大;木原一禎;鯉渕幸生;三浦ゆきこ;近藤康文;石川光男;木原一禎・鯉渕幸生・三浦ゆきこ・近藤康文・後藤大・石川光男;Weitao Cheng;木原一禎・鯉渕幸生・三浦ゆきこ・石川光男・後藤大・近藤康文;Takafumi Fukushima
• 通讯作者: Takafumi Fukushima