Three-Dimensionally Stacked Hetero-Chip Fabrication by Self-Assembly

我们利用液滴的表面张力，提供了基于高精度多芯片自组装的新型三维集成技术。利用自组装技术成功地制作了异质多芯片测试模块。该芯片的对准精度在1微米以内，可以批量在基板上自组装500多个芯片。此外，芯片在室温下与基板紧密结合，没有热压缩。

We have provided new three-dimensional integration technology based on high-precision multi-chip self-assembly using surface tension of liquid droplets. We have successfully fabricated heterogeneous multi-chip test module using the self-assembly technology. The alignment accuracy was found to be within 1 micron, and more than 500 chips can be self-assembled on substrates in batch. In addition, the chips were tightly bonded to the substrates at room temperature without thermal compression.