Fabrication and Thermomechanical Properties of Silica/Epoxy Nanocomposite as a Reliable Electronic Material

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A simple method for the fabrication of silica/epoxy nanocomposites was investigated, whereby silica nanoparticles without any surface modification were dispersed uniformly through mechanical breakdown of loosely packed agglomerates of silica nanoparticles with low fracture strength in an organic solution to form the matrix phase. When loosely packed silica agglomerates with numerous large pores were mixed in the solution containing the epoxy polymers with relatively lower viscosity, a uniform dispersion of isolated primary silica nanoparticles of 190 nm in diameter could be achieved in the epoxy matrix even for 50 wt% of silica filling fraction. Thermal omechanical analyses of the fabricated silica/epoxy nanocomposites revealed that the reduction of the coefficient of thermal expansion (CTE) and the improvement in thermostability for the nanocomposite is mainly controlled by the volume fraction of the silica nanospheres in the epoxy matrix.