Novel High Frequency-compatible Low-CTE and Low-CHE Heat-resistant Dielectric Materials

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Flexible printed circuit boards(FPC) are frequently used in various electronic devices such as mobile phones, TVs, cameras, personal computers. Recent trends to lightening, thinning, and miniaturizing for their devices also bring about strong demands toward further improved performances and functionalization of high-temperature polymeric materials used in FPCs, e. g., good dielectric properties at GHz ranges and excellent dimensional stability against thermal cycles and water absorption. The present research project successfully provided novel heat-resistant dielectric materials possessing excellent combined properties. The products obtained in this work are expected to be applied to various electronic devices.