Development of Health Monitoring Technique for Thermal Fatigue Evaluation in High Density PCBs by Synchrotron Radiation CT

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In this work, synchrotron radiation CT technique was first applied to the nondestructive evaluation of the reliability in high density printed circuit boards. The developed technology helps nondestructive monitoring all the process, in which cracks in micro-joints initiate, propagate, and reach to fracture, in addition, helps estimating the lifetime to failure. This result will widely contribute to the improvement of the reliability and the development of electronic equipment.