Development of ultra-precision cutting method for composite material with thermosetting resin and electric conductor

研究了一种新型的热固性树脂导电体复合材料精密切割方法。在大规模集成电路的制造过程中，需要用热固性树脂在两个陶瓷基板之间进行粘贴。为了实现树脂加工表面的高平整度，本研究开发了一种新的单晶金刚石切割法。

This study deals development of a new precision cutting method for composite material with thermosetting resin and electric conductor. In manufacturing process of a large scale integrated circuit, a pasting process between two ceramic substrates with thermosetting resin is required. In this study, a new cutting method with single crystal diamond byte to realize high flatness of machined resin surfaces is developed.