Vapor-assisted hybrid bonding of organic/inorganic substrates at low temperature and atmospheric pressure

在150℃和常压下，实现了Cu、Ti、玻璃、石英和聚二甲基硅氧烷（PDMS）的气相辅助杂化键合。与传统的高真空氩快原子束轰击不同，我们采用了真空紫外（VUV）在氮气中辐照。我们发现最初的表面污染物被成功地去除了，一部分金属氧化物被减少了，这可能是由于残留的水产生的氢自由基。对于这样的表面，分子水被配位并形成了薄的桥接层，其中氢键有助于表面之间的初始接触，随后的脱水收缩使界面结构稳定。所有的原料都是紧密粘合的；特别是，PDMS衬底之间的界面显示相当小的透明度损失在380 - 1000 nm。并将该方法应用于超薄石墨电极的互连。

Vapor-assisted hybrid bondings of Cu, Ti, glass, quartz, and polydimethylsiloxane (PDMS) were realized at 150 C and atmospheric pressure. Unlike the conventional Ar fast atom beam bombardment in high vacuum, we utilized the vacuum ultraviolet (VUV) irradiation in the nitrogen gas. We found out that the initial surface contaminants were successfully removed, a part of metal oxide was reduced due probably to the hydrogen radical created from the residual water. For such surfaces, the molecular water was coordinated and created thin bridging layer, where the hydrogen bond contributed to the initial contact between surfaces, followed by the dehydration shrinkage to make the interfacial structure stable. All the starting materials were tightly bonded; in particular, the interface between PDMS substrates indicated considerably small loss of transparency among 380 - 1000 nm. Moreover, this method was applied for the interconnection of ultrathin graphite electrodes.