Metallization of polymer surfaces for downsizing of electronic devices

点击翻译按钮获取中文摘要

The concept of this project is based on the preliminary results, which have been published by the head investigator in the Journal (Macromolecules). These are (1) Improved Adhesion between Kapton Film and Copper Metal by Plasma Graftpolymerization of Vinylimidazole (Macromolecules, vol. 29, pp. 1642-1648 (1996)), and (2) Surface Modification of Poly(tetrafluoroethylene) by remote Hydrogen Plasma (Macromolecules, vol. 29, pp. 4331-4339 (1996)). Introduction of some residues which can strongly interact with metal surface are introduced into the polymer surfaces is an essential factor in order to metallize polymer surfaces. Following procedures were designed:For copper metallization of polyimide which is superior to electrical resistance, mechanical and thermal properties, the imidazole group was used as a residue to interact strongly with copper metal surface. 3'(Trimethoxysilyl)propoxy-2-hydroxypropyl-1,3-diazole was coupled with Kapton film surfaces which had been treated with argon plasma (plasma treatment). For copper metallization of fluoropolymers which are excellent electrical resistance in the high frequency current, the carbonyl group which was formed by hydrogen plasma treatment was used as a residue to interact wit metal surface.The copper metallization of these polymer surfaces succeeded. The adhesion between the copper metal and polymer surface was good for practice usage.