Metallization of polymer surfaces for downsizing of electronic devices

聚合物表面金属化以缩小电子设备的尺寸

• 批准号: 09555201
• 负责人: INAGAKI Norihiro
• 金额: $ 8.13万
• 依托单位: Shizuoka University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 1997
• 资助国家: 日本
• 起止时间: 1997 至 1999
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-09555201/
• 关键词: Copper metallization; Teflon; Polyimide; Plasma treatment; Silane coupling; Electroless plating; Electro plating; Imidazole; 表面金属化; メタライジング; フッ素ポリマー; 同軸ケーブル; プリント配線基板; シランカップリング反応; ポリテトラフルオロエチレン; リモートプラズマ

The concept of this project is based on the preliminary results, which have been published by the head investigator in the Journal (Macromolecules). These are (1) Improved Adhesion between Kapton Film and Copper Metal by Plasma Graftpolymerization of Vinylimidazole (Macromolecules, vol. 29, pp. 1642-1648 (1996)), and (2) Surface Modification of Poly(tetrafluoroethylene) by remote Hydrogen Plasma (Macromolecules, vol. 29, pp. 4331-4339 (1996)). Introduction of some residues which can strongly interact with metal surface are introduced into the polymer surfaces is an essential factor in order to metallize polymer surfaces. Following procedures were designed:For copper metallization of polyimide which is superior to electrical resistance, mechanical and thermal properties, the imidazole group was used as a residue to interact strongly with copper metal surface. 3'(Trimethoxysilyl)propoxy-2-hydroxypropyl-1,3-diazole was coupled with Kapton film surfaces which had been treated with argon plasma (plasma treatment). For copper metallization of fluoropolymers which are excellent electrical resistance in the high frequency current, the carbonyl group which was formed by hydrogen plasma treatment was used as a residue to interact wit metal surface.The copper metallization of these polymer surfaces succeeded. The adhesion between the copper metal and polymer surface was good for practice usage.

该项目的概念是基于初步结果，该结果已由首席研究员在《大分子》杂志上发表。这些是(1)通过等离子体接枝聚合Vinylimidazole改善Kapton薄膜和铜金属之间的附着力（Macromolecules, vol. 29, pp. 1642-1648(1996)），以及(2)远距离氢等离子体修饰聚四氟乙烯（Macromolecules, vol. 29, pp. 4331-4339(1996)）。在聚合物表面引入一些能与金属表面发生强烈相互作用的残留物是使聚合物表面金属化的必要因素。设计了以下工艺流程：利用咪唑基作为残基与铜金属表面发生强相互作用，使聚酰亚胺铜金属化，从而获得电阻、机械和热性能优越的性能。3′（三甲氧基硅基）丙氧基-2-羟丙基-1,3-二唑与经氩等离子体处理的Kapton膜表面偶联。利用氢等离子体处理后形成的羰基作为残留物与金属表面相互作用，对高频电阻抗优异的含氟聚合物的铜金属化进行了研究。这些聚合物表面的铜金属化成功了。在实际应用中，铜金属与聚合物表面的附着力良好。

项目成果

N. Inagaki, S. Tasaka, and Y. Goto: "Surface modification of poly(tetrafluoroethylene) film by graftpolymerization of sodium vinylsulfonate"Journal of Applied Polymer Science. vol. 66. 77-84 (1997)

N. Inagaki、S. Tasaka 和 Y. Goto：“通过乙烯基磺酸钠接枝聚合对聚四氟乙烯薄膜进行表面改性”应用聚合物科学杂志。

N.Inagaki, S.Tasaka, and Y. W .Park: "Effects of the surface modification by remote hydrogen plasma on adhesion in the electroless copper/tetrafluoroethylene-hexafluoropropylene copolymer (FEP) system" Journal of Adhesion Science and Technology. 12. 1105-

N.Inagaki、S.Tasaka 和 Y.W.Park：“远程氢等离子体表面改性对化学镀铜/四氟乙烯-六氟丙烯共聚物 (FEP) 系统粘合力的影响”《粘合科学与技术杂志》。

N. Inagaki, S. Tasaka, K. Narushima, and K. Mochizuki: "Surface modification of tetrafluoroethylene-perfluoroalkyl vinylether copolymer by remote hydrogen plasma and surface metallization with electroless plating copper metal"Macromolecules. vol. 32. 5866

N. Inagaki、S. Tasaka、K. Narushima 和 K. Mochizuki：“通过远程氢等离子体对四氟乙烯-全氟烷基乙烯基醚共聚物进行表面改性，并用化学镀铜金属进行表面金属化”大分子。

N.Inagaki, S.Tasaka and t.Umehara: "Effects of surface modification by remote hydrogen plasma on adhesion in Poly(tetrafluoroethylene)/copper composite"Journal of Applied Polymer Science. 71. 2191-2200 (1999)

N.Inagaki、S.Tasaka 和 t.Umehara：“远程氢等离子体表面改性对聚（四氟乙烯）/铜复合材料粘合性的影响”应用高分子科学杂志。

N. Inagaki, S. Tasaka, and T. Umehara: "Effects of surface modification by remote hydrogen plasma on adhesion in poly(tetrafluoroethylene)/copper composite"Journal of Applied Polymer Science. vol. 71. 2191-2200 (1999)

N. Inagaki、S. Tasaka 和 T. Umehara：“远程氢等离子体表面改性对聚（四氟乙烯）/铜复合材料粘合力的影响”应用聚合物科学杂志。