Photonic Integrated Circuit Packaging ACademy (PICPAC)

光子集成电路封装学院 (PICPAC)

• 批准号: 10073994
• 金额: $ 50.8万
• 依托单位: BAY PHOTONICS LTD
• 依托单位国家: 英国
• 项目类别: Collaborative R&D
• 财政年份: 2023
• 资助国家: 英国
• 起止时间: 2023 至 无数据
• 项目状态: 未结题
• 来源: https://gtr.ukri.org/projects?ref=10073994
• 关键词: Photonic; Integrated; Circuit; Packaging; ACademy

The Photonic Integrated Circuit Packaging ACademy (PICPAC) project shall create and deliver course content and materials on packaging necessary to enable the rapidly growing field of photonics within the semiconductor sector. Semiconductor based photonics devices are critical in enabling telecommunications, datacomms, imaging, and quantum technologies (e.g. quantum computing, quantum cryptography and quantum sensing). However, to operate in real world applications, delicate semiconductor chips must be packaged to interface with the outside world. Aspects of photonic packaging that must be considered are the mechanical, electrical, thermal and photonic interfaces as well as the interplay between the different aspects. While there has been much recent investment in foundry activities (upstream semiconductor activity) there has been little investment in downstream activities (assembly, packaging and testing - APT) and their is a clear gap in practical knowledge in the area of APT within the UK semiconductor landscape.The PICPAC project aims to create a national centre for semiconductor photonic packaging training located within the nationally recognized South West semiconductor cluster. Bay Photonics (BP) and Davies & Bell (DB) will capture industrial training requirements and create course content together with South Devon College (SDC) who will deliver the courses in a variety of formats. The format of the courses will be flexible and the timing will be flexible (effectively, on demand), to align with the needs of industry. Once created, this will be the only programme of its kind in the country.

光子集成电路封装学院(PICPAC)项目将创建和提供必要的封装课程内容和材料，以支持半导体行业内快速增长的光电子学领域。基于半导体的光电子器件在实现电信、数据通信、成像和量子技术(例如量子计算、量子密码学和量子传感)方面至关重要。然而，为了在现实世界的应用中运行，精致的半导体芯片必须被封装以与外部世界接口。光子封装必须考虑的方面是机械、电气、热和光子接口以及不同方面之间的相互作用。虽然最近对代工活动(上游半导体活动)进行了大量投资，但对下游活动(组装、封装和测试-APT)的投资很少，而且他们在APT领域的实践知识方面存在明显的差距。PICPAC项目旨在创建一个位于国家认可的西南半导体集群内的国家半导体光子封装培训中心。Bay Photonics(BP)和Davies&Bell(DB)将捕捉行业培训需求，并与南德文学院(SDC)共同创建课程内容，后者将以各种形式提供课程。课程的形式将是灵活的，时间也将是灵活的(有效地，根据需要)，以符合行业的需要。一旦创建，这将是该国唯一的此类项目。