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Quantum Photonic Integrated Circuit Packaging (QPICPAC)

量子光子集成电路封装（QPICPAC）

基本信息

批准号：
10032139
负责人：
金额：
$ 51.04万
依托单位：
WAVE PHOTONICS
依托单位国家：
英国
项目类别：
Collaborative R&D
财政年份：
2022
资助国家：
英国
起止时间：
2022 至无数据
项目状态：
已结题

来源：
https://gtr.ukri.org/projects?ref=10032139
关键词：
Quantum Photonic Integrated Circuit Packaging

项目摘要

Quantum Photonic Integrated Circuits (QPICs), similarly to their classical counterparts Photonic Integrated Circuits (PICs), are a technology that takes advantage of the decades of development in semiconductor processing for the integrated electronics to create chip-based circuits for light that can be cost-effectively mass produced. QPICs are at the centre of most of the photonic approaches to quantum computing such as those being taken by PsiQuantum, Xanadu and QuiX, but are also vital for the scalability of light-dependent quantum technologies trapped ion/diamond-impurity-based quantum computing, quantum sensing, quantum key distribution (QKD) and quantum random number generation.Unlike their classical counterparts, QPICs often need extremely low loss and to perform in extreme environments such as at low temperature or in space, which results in difficulties in packaging these devices. At present, QPIC packaging is done on a bespoke, case-by-case basis, meaning that is slow and costly, creating a barrier to the development of QPIC-based products.Led by Wave Photonics, the consortium comprised of Alter Technology, SENKO Advanced Components, Southampton University and Bristol University will develop a template, design guide and packaging process to allow for rapid and cost-effective packaging of QPICs. Quantum Dice will act as a representative end user.

量子光子集成电路（QPIC），类似于它们的经典对应物光子集成电路（PIC），是一种利用集成电子器件半导体加工数十年的发展来创建基于芯片的光电路的技术，可以成本有效地大规模生产。QPIC是大多数量子计算光子方法的核心，例如PsiQuantum，Xanadu和QuiX所采用的方法，但对于基于离子/金刚石杂质的量子计算，量子传感，量子密钥分配（QKD）和量子随机数生成的光依赖量子技术的可扩展性也至关重要。QPIC通常需要极低的损耗，并在极端环境下（如低温或太空中）工作，这导致这些器件的封装困难。目前，QPIC封装是在定制的，逐案的基础上进行的，这意味着缓慢和昂贵，为基于QPIC的产品的开发创造了障碍。由Wave Photonics领导，由Alter Technology，SENKO Advanced Components，南安普顿大学和布里斯托大学组成的财团将开发模板，设计指南和封装过程，以实现快速和具有成本效益的QPIC封装。Quantum Dice将作为最终用户代表。