Quantum Photonic Integrated Circuit Packaging (QPICPAC)

量子光子集成电路(QPIC)与经典的光子集成电路(PIC)类似，是一种利用半导体工艺几十年的发展为集成电路制造基于芯片的光电路的技术，可以经济高效地批量生产。QPIC是量子计算中大多数光子方法的核心，例如PsiQuantum、Xanadu和Quix所采用的方法，但对于依赖光的量子技术的可扩展性也是至关重要的。基于离子/钻石杂质的量子计算、量子传感、量子密钥分发(QKD)和量子随机数生成。与经典的量子计算方法不同，QPIC通常需要极低的损耗，并且需要在低温或太空等极端环境中运行，这导致了这些器件的封装困难。目前，QPIC封装是以个案为基础进行定制的，这意味着速度慢且成本高，这对基于QPIC的产品的开发造成了障碍。由浪潮光电子公司牵头，由Alter Technology、Senko Advanced Components、南安普顿大学和布里斯托尔大学组成的财团将开发模板、设计指南和封装过程，以实现快速且具有成本效益的QPIC封装。量子骰子将作为代表性的最终用户。

Quantum Photonic Integrated Circuits (QPICs), similarly to their classical counterparts Photonic Integrated Circuits (PICs), are a technology that takes advantage of the decades of development in semiconductor processing for the integrated electronics to create chip-based circuits for light that can be cost-effectively mass produced. QPICs are at the centre of most of the photonic approaches to quantum computing such as those being taken by PsiQuantum, Xanadu and QuiX, but are also vital for the scalability of light-dependent quantum technologies trapped ion/diamond-impurity-based quantum computing, quantum sensing, quantum key distribution (QKD) and quantum random number generation.Unlike their classical counterparts, QPICs often need extremely low loss and to perform in extreme environments such as at low temperature or in space, which results in difficulties in packaging these devices. At present, QPIC packaging is done on a bespoke, case-by-case basis, meaning that is slow and costly, creating a barrier to the development of QPIC-based products.Led by Wave Photonics, the consortium comprised of Alter Technology, SENKO Advanced Components, Southampton University and Bristol University will develop a template, design guide and packaging process to allow for rapid and cost-effective packaging of QPICs. Quantum Dice will act as a representative end user.