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Quantum Photonic Integrated Circuit Packaging (QPICPAC)

Quantum Photonic Integrated Circuit Packaging (QPICPAC)
量子光子集成电路封装(QPICPAC)
批准号:
10032139
负责人:
金额:
$51.04万
依托单位:
依托单位国家:
英国
项目类别:
Collaborative R&D
财政年份:
2022
资助国家:
英国
项目状态:
已结题
起止时间:
2022 至 --

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英文摘要
Quantum Photonic Integrated Circuits (QPICs), similarly to their classical counterparts Photonic Integrated Circuits (PICs), are a technology that takes advantage of the decades of development in semiconductor processing for the integrated electronics to create chip-based circuits for light that can be cost-effectively mass produced. QPICs are at the centre of most of the photonic approaches to quantum computing such as those being taken by PsiQuantum, Xanadu and QuiX, but are also vital for the scalability of light-dependent quantum technologies trapped ion/diamond-impurity-based quantum computing, quantum sensing, quantum key distribution (QKD) and quantum random number generation.Unlike their classical counterparts, QPICs often need extremely low loss and to perform in extreme environments such as at low temperature or in space, which results in difficulties in packaging these devices. At present, QPIC packaging is done on a bespoke, case-by-case basis, meaning that is slow and costly, creating a barrier to the development of QPIC-based products.Led by Wave Photonics, the consortium comprised of Alter Technology, SENKO Advanced Components, Southampton University and Bristol University will develop a template, design guide and packaging process to allow for rapid and cost-effective packaging of QPICs. Quantum Dice will act as a representative end user.
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