SOURCE - Semiconductor Open Access System-in-Package Scale-up Feasibility

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SOURCE is a feasibility study and proof-of-concept for the potential scale up of an open access, system in package, advanced packaging platform in the UK. The platform targets heterogeneous integration of multiple semiconductor chip types within the same encapsulated package, achieving reduced size and weight while enabling increased device functionality and performance.Alter UK's assembly capabilities will be reviewed, and a demonstrator package will be produced as part of this study. Assembly design rules will be produced to guide future customers designs into this platform. Rydon Technology will perform a study on relevant materials, suppliers, and software to enable the IC substrate procurement. A market study will be conducted to introduce the capability to customers and scope out the scale up to volume production.