SOURCE - Semiconductor Open Access System-in-Package Scale-up Feasibility

源是一个可行性研究和概念验证的潜在规模扩大的开放获取，系统在包，先进的包装平台在英国。该平台的目标是在同一封装内集成多种半导体芯片类型，实现减小尺寸和重量，同时提高器件的功能和性能。Alter UK的组装能力将被审查，并将作为本研究的一部分生产演示包。装配设计规则将产生，以指导未来的客户设计到这个平台。Rydon Technology将对相关材料、供应商和软件进行研究，以实现IC基板采购。将进行市场研究，向客户介绍该能力，并扩大规模，以批量生产。

SOURCE is a feasibility study and proof-of-concept for the potential scale up of an open access, system in package, advanced packaging platform in the UK. The platform targets heterogeneous integration of multiple semiconductor chip types within the same encapsulated package, achieving reduced size and weight while enabling increased device functionality and performance.Alter UK's assembly capabilities will be reviewed, and a demonstrator package will be produced as part of this study. Assembly design rules will be produced to guide future customers designs into this platform. Rydon Technology will perform a study on relevant materials, suppliers, and software to enable the IC substrate procurement. A market study will be conducted to introduce the capability to customers and scope out the scale up to volume production.