Reconfigurable semiconductor technology for advanced neural implants
Reconfigurable semiconductor technology for advanced neural implants
批准号:
10094495
负责人:
金额:
$79.64万
依托单位国家:
英国
项目类别:
Collaborative R&D
财政年份:
2024
资助国家:
英国
项目状态:
未结题
起止时间:
2024 至 --
中文摘要
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英文摘要
Neurological conditions are the leading cause of disability and the second cause of deaths worldwide. Monitoring and treating these diseases is incredibly difficult as targets are encased in thick bone and special membranes in the circulatory system block many drugs.Advanced neural implants, comprising electronics placed inside the skull or spine, are an exciting technology that could revolutionise our understanding of the brain and treat associated conditions---enabling people to walk again; children to hear for the first time; or relieving the symptoms of epilepsy or Parkinson's disease.However, such devices require complex electronics with tight constraints on size and power, whilst also complying with the most stringent regulatory requirements (Active Implantable Medical Devices). As a result, implants can take years and hundreds of millions of pounds to develop---a major barrier and risk for innovators, investors, and small-medium sized companies.Our vision is to create a set of modular chips (or microchips) that meet these challenges. Advanced packaging techniques combine these together into tiny systems to enable companies and researchers to rapidly address different needs. In this way, we minimise implant size and power consumption, opening up new approaches for surgery (akin to the switch to keyhole surgery) that reduce risks to patients.This project is a collaboration between Mint Neurotechnologies, Amber Therapeutics, and Imperial College London to co-create a "chipset" (group of chips designed to work together for a specific application) and package it into a device. This will first constitute the electronics of a medical device for treating mixed urinary incontinence (no other treatment available on the market yet) and will unlock new device therapies beyond the first application.More long-term, these chipset and packaging capabilities will enable faster, cheaper development of implants, making the technology accessible for patients with rarer or currently untreated neurological conditions.
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国内基金
海外基金
层状半导体材料纳米结构中激子分离动力学研究
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批准号:22073022
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项目类别:面上项目
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资助金额:63.0万元
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批准年份:2020
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负责人:刘新风
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依托单位: