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COMPAS: co integration of microelectronics and photonics for air and water sensors

COMPAS: co integration of microelectronics and photonics for air and water sensors
COMPAS:微电子学和光子学的共同集成,用于空气和水传感器
批准号:
10108154
负责人:
金额:
$58.45万
依托单位:
依托单位国家:
英国
项目类别:
EU-Funded
财政年份:
2024
资助国家:
英国
项目状态:
未结题
起止时间:
2024 至 --

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中文摘要
翻译
COMPAS的主要目标是开发一种紧凑、廉价和超灵敏的PIC传感平台(PSP),用于空气和水的监测,依靠光源、探测器和电子IC的协整,用于片上信号处理。PIC传感器原理将基于两种导光模式之间的干涉,其中一种与分析物相互作用,另一种作为参考。由此产生的强度变化对空气或溶液中分析物浓度的变化具有极好的敏感性。多个光路可以放置在同一设备上,在一个超紧凑的设备中提供多分析物传感。COMPAS围绕这一原理(包括光源、探测器和信号处理)构建了首个完全集成的系统。COMPAS PSP从TRL2开始,最终用户在相关环境中进行空气和水监测的TRL5验证。该项目将-定义传感参数,以验证开发的PIC传感器平台(PSP)在相关环境中的三个用例,符合欧洲绿色协议的零污染目标-开发核心光子技术,实现基于光子的传感。其中包括一种新型光子IC材料系统(氮化铝),显示出卓越的温度稳定性和灵敏度的双峰波导干涉仪,用于增强传感选择性的新型材料涂层系统,以及用于新型模式工程的创新纳米结构超表面,用于提高灵敏度和优化光耦合,以促进低功率激光二极管的使用。-开发一种将光子传感器与微电子集成电路、光电探测器和相干光源协整的Chiplet方法。这将结合异质集成的激光光源和单片集成光电探测器在硅基材料。
英文摘要
The main objective of COMPAS is to develop a compact, inexpensive and ultrasensitive PIC sensing platform (PSP) for air and water monitoring, relying on the co-integration of light source, detectors and electronic IC for on-chip signal processing. The PIC sensor principle will be based on interference between two guided light modes, one of which interacts with analytes and the other being a reference. The resulting intensity changes offers excellent sensitivity to changes in concentration of analytes in air or solution. Multiple light paths can be placed on the same device offering multi-analyte sensing in an ultracompact device. COMPAS builds a first-of-a kind fully integrated system around this principle (including light source, detectors and signal processing). The COMPAS PSP begins at TRL2 and will end with TRL5 validation in relevant environment by end-users towards air and water monitoring. The project will - Define sensing parameters for validating developed PIC Sensor Platform (PSP) towards three use-cases in relevant environments, being in line with the European Green Deal’s zero pollution ambition - Develop core photonic technology for implementing photonic based sensing. These include a novel photonic IC material system (Aliminium Nitride), BiModal waveguide interferometers that show superior temperature stability and sensitivity, novel material coating systems for enhanced sensing selectivity and innovative nano structured metasurfaces for novel mode engineering for increased sensitivity and optimized light coupling to facilitate the use of low power laser diodes. - Develop a Chiplet approach to co-integration of photonic sensor with microelectronic IC and photodetectors, and a coherent light-source. This will combine heterogeneous integration of a laser light source and monolithically integrated photodetector in the silicon base material.
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