TRIuMPHANT: TheRmal Interface Material based on Phase Cahange MAterials for Heat mANagemenT

TRUMPHANT：基于相变材料的热界面材料，用于热管理

• 批准号: 132507
• 金额: $ 8.9万
• 依托单位: DYCOTEC MATERIALS LTD
• 依托单位国家: 英国
• 项目类别: Feasibility Studies
• 财政年份: 2017
• 资助国家: 英国
• 起止时间: 2017 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=132507
• 关键词: TRIuMPHANT; TheRmal; Interface; Material; based

Electronic technology is continuously advancing and increasingly impacting on all areas of life and business through the use of products (such as mobile phones, lap-tops, tablets, and LED lighting) where there is an increasing need for higher power and more compact electronics. As a result, overheating is becoming a critical issue limiting further miniaturisation, power, performance & reliability. Thermal management to reduce heat build-up and minimise thermal damage is a critical need for a range of customers such as large electronic OEMs including: Intel, Apple, HP, Sony, Siemens, Sharp, Panasonic, Cisco and LG. These OEMs are actively searching for Thermal Interface Materials (TIMs) that can be applied to their market offerings. Due to the tight cost constraints within this industry, it is important that any solution can be applied quickly and cost-effectively preferably using existing equipment. The TRIuMPHANT project Approach and Innovation is to develop a Phase Change Thermal Interface Material that can achieve thermal conductivity >7W/m.K, twice that currently achievable, that can be cost-effectively applied using conventional deposition techniques. Exploitation of the technology through our existing global network of distributors will result in significantly increased revenues and profits, making our consortium partners more competitive globally. Manufacture in the UK (Swindon and Leicestershire) will also give us greater control of the supply chain and quality, allowing us to achieve long-term competitiveness.

电子技术不断进步，并通过使用产品（如手机、笔记本电脑、平板电脑和LED照明）对生活和商业的各个领域产生越来越大的影响，这些产品对更高功率和更紧凑的电子产品的需求日益增加。因此，过热正成为限制进一步小型化、功率、性能和可靠性的关键问题。热管理以减少热量积聚并最大限度地减少热损伤是一系列客户的关键需求，例如大型电子oem，包括：英特尔、苹果、惠普、索尼、西门子、夏普、松下、思科和LG。这些原始设备制造商正在积极寻找可应用于其市场产品的热界面材料（TIMs）。由于该行业严格的成本限制，任何解决方案都必须能够快速、经济有效地应用于现有设备，这一点非常重要。凯乐项目的方法和创新是开发一种相变热界面材料，该材料的导热系数可以达到7W/m。K，是目前可实现的两倍，可以经济有效地应用传统沉积技术。通过我们现有的全球分销商网络开发这项技术将大大增加收入和利润，使我们的联盟合作伙伴在全球范围内更具竞争力。在英国（斯温顿和莱斯特郡）生产也将使我们更好地控制供应链和质量，使我们能够实现长期竞争力。