Advanced Etching and Optical Coating for Low Cost Laser Diode Manufacturing

用于低成本激光二极管制造的先进蚀刻和光学镀膜

• 批准号: 133179
• 金额: $ 37.64万
• 依托单位: SIVERS PHOTONICS LIMITED
• 依托单位国家: 英国
• 项目类别: Feasibility Studies
• 财政年份: 2017
• 资助国家: 英国
• 起止时间: 2017 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=133179
• 关键词: Advanced; Etching; Optical; Coating; Low

The objective of the project is to reduce the cost of manufacturing compound semiconductor laser diodes. In the key markets for laser diodes such as Fibre To The Home (FTTH) and in DataCentre (DC) networks, laser diode cost is a critical factor . Compound Semiconductor Technologies Global Ltd is currently serving these markets however in order to remain competitive against laser diode suppliers globally, it is necessary to develop manufacturing processes and technology that will maintain the company's competitiveness. Project therefore addresses the competition scope by developing an innovative enabling capability in compound semiconductors to improve productivity. This will be achieved through the development of an advanced etch and passivation process that will be applied to the laser diode wafers and will allow the facets of the laser diodes to be coated while still in wafer format. A typical 3 inch diameter laser diode wafer contains over 1000 bars and therefore the benefit of this approach is that it removes the labour intensive approach of cleaving the wafer into bars and mounting the individual bars in jigs to perform the dielectric coating process. The development of the process will lead to substantial savings in the manufacturing cost of laser diodes.

该项目的目标是降低化合物半导体激光二极管的制造成本。在光纤到户（FTTH）和数据中心（DC）网络等激光二极管的关键市场中，激光二极管的成本是一个关键因素。Compound Semiconductor Technologies Global Ltd目前服务于这些市场，但为了保持与全球激光二极管供应商的竞争力，有必要开发制造工艺和技术，以保持公司的竞争力。因此，该项目通过开发化合物半导体的创新能力来提高生产力，从而解决竞争问题。这将通过开发先进的蚀刻和钝化工艺来实现，该工艺将应用于激光二极管晶片，并允许激光二极管的端面在仍处于晶片形式时被涂覆。典型的3英寸直径的激光二极管晶片包含超过1000个条，因此该方法的益处在于其去除了将晶片切割成条并将各个条安装在夹具中以执行电介质涂覆工艺的劳动密集型方法。该工艺的发展将大大节省激光二极管的制造成本。