Thermally-Aware Power Distribution Networks for Vertically Integrated Systems

适用于垂直集成系统的热感知配电网络

• 批准号: EP/M009238/1
• 负责人: Vasilis Pavlidis
• 金额: $ 63.87万
• 依托单位: University of Manchester
• 依托单位国家: 英国
• 项目类别: Research Grant
• 财政年份: 2015
• 资助国家: 英国
• 起止时间: 2015 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=EP%2FM009238%2F1
• 关键词: Thermally; Aware; Power; Distribution; Networks

Electronic products have played an overarching role in our societies. The evolution of portable and handheld devices in the past two decades has further augmented the pervasiveness of electronics into our daily activities. In general, the majority of modern electronic products require a heterogeneous set of components. These products include common portable devices or sophisticated systems used in medicine and industry for safety, monitoring, prevention, or therapy. This system heterogeneity will be intensified in the future, since the primary demand for faster processing of the information is augmented by the requirement for accurate sensing and detection of environmental stimuli.Although these devices have created a flourishing market, the design of high performance and low power computing systems beyond consumer demands remains an omnipresent challenge. The design of more powerful computers is driven not only by the need to answer important scientific questions but also to address new or on-going societal needs. A characteristic example is the data-centers which they offer a variety of services but the relating energy-cost is increasing at an alarming rate. To mitigate these issues scientists and researchers explore disruptive technologies. A promising technology is three-dimensional (3-D) or vertical integration. This emerging technology has appealed to both industry and academia for several reasons. For example, considering the case of portable products, a vertically integrated system can drastically reduce the size of the board, which hosts the various components, by stacking these subsystems into a multi-tier structure reducing the overall size and improving power consumption.This project will contribute to the evolution of vertically integrated systems by providing new design techniques and innovative analysis tools for the power distribution network of these systems. To better explain the complexity as well as the significance of this task, consider the power grid that supplies our residences. A similar yet severely constrained grid provides current to each transistor within an integrated circuit. The design complexity of this network for vertical multi-tier circuits is much higher similar to the case where the electric installation of a multi-storey building is much more complicated than that of a house. The scale of the problem where billion of "consumers" (i.e. transistors) must be provided with abundant current underlines the need for faster and accurate analysis methods. In this project, the analysis will be complemented by optimization methods, as the resources for the power network are limited and compete with other resources. Using our civic analogy, think of a situation where phone and power cables compete for a limited open space.Efficient solutions to this problem cannot resort solely to existing design methodologies and/or numerical techniques due to the size of the problem as well as the heterogeneity of the envisioned vertical systems. The proposed research therefore aims at advancing the analysis and design methods of power networks for integrated systems while considering the particular traits and constraints relating to these systems. The results of the project will boost this emerging technology, bringing vertical integration a stride closer to economical high-volume manufacturing.

电子产品在我们的社会中发挥着至关重要的作用。在过去的二十年里，便携式和手持设备的发展进一步增强了电子产品在我们日常活动中的普及。一般来说，大多数现代电子产品需要一组异构的组件。这些产品包括医疗和工业中用于安全、监测、预防或治疗的常见便携式设备或复杂系统。这种系统的异质性将在未来加剧，因为对更快的信息处理的主要需求被对环境刺激的准确感测和检测的需求所增强。尽管这些设备创造了一个繁荣的市场，但设计出超出消费者需求的高性能和低功耗计算系统仍然是一个无所不在的挑战。设计更强大的计算机不仅是为了回答重要的科学问题，也是为了满足新的或正在进行的社会需求。一个典型的例子是数据中心，他们提供各种服务，但相关的能源成本正在以惊人的速度增长。为了缓解这些问题，科学家和研究人员探索颠覆性技术。一种有前途的技术是三维（3-D）或垂直集成。这项新兴技术吸引了工业界和学术界，原因有几个。例如，考虑到便携式产品的情况，垂直集成系统可以大大减小承载各种组件的电路板的尺寸，通过将这些子系统堆叠成多个该项目将通过为配电网络提供新的设计技术和创新的分析工具，为垂直集成系统的发展做出贡献。这些系统。为了更好地解释这项任务的复杂性和重要性，考虑一下为我们的住宅供电的电网。一个类似但严格受限的网格为集成电路内的每个晶体管提供电流。垂直多层电路的这种网络的设计复杂性要高得多，类似于多层建筑物的电气安装比房屋复杂得多的情况。必须为数十亿“消费者”（即晶体管）提供充足电流的问题的规模强调了对更快和更准确的分析方法的需求。在本项目中，分析将通过优化方法进行补充，因为电力网络的资源是有限的，并与其他资源竞争。使用我们的城市类比，想想电话和电力电缆争夺有限的开放空间的情况，由于问题的规模以及设想的垂直系统的异质性，这个问题的有效解决方案不能仅仅依靠现有的设计方法和/或数值技术。因此，建议的研究旨在推进电力网络的分析和设计方法，同时考虑到这些系统的特殊性和约束条件。该项目的成果将推动这一新兴技术的发展，使垂直整合更接近经济的大批量制造。

项目成果

Crosstalk noise effects of on-chip inductive links on power delivery networks

片上电感链路的串扰噪声对供电网络的影响

• DOI: 10.1109/iscas.2016.7538953
• 发表时间: 2016
• 作者: Papistas I

Computationally Efficient Standard-Cell FEM-based Thermal Analysis

基于计算效率的标准单元 FEM 热分析

• 发表时间: 2017
• 作者: Y.-C. Chen

IC thermal analyzer for versatile 3-D structures using multigrid preconditioned krylov methods

使用多重网格预处理 krylov 方法的多功能 3D 结构 IC 热分析仪

• DOI: 10.1145/2966986.2967045
• 发表时间: 2016
• 作者: Ladenheim S

The MTA: An Advanced and Versatile Thermal Simulator for Integrated Systems

• DOI: 10.1109/tcad.2018.2789729
• 发表时间: 2018-01
• 期刊: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
• 影响因子: 2.9
• 作者: S. Ladenheim;Yi-Chung Chen;M. Mihajlovic;V. Pavlidis