Aerosol Deposition for Manufacturing and Developing Next Generation Dielectric Charge Storage Devices

可再生能源中的电力电子设备和恶劣环境下的电子设备需要坚固耐用的介电电荷存储设备，在高压和高温下提供可靠的操作。宽禁带半导体、互连和高温封装领域已经发生了一场革命，允许在300摄氏度的温度下运行。在介质电荷存储技术方面还没有取得类似的突破：克服这一障碍将推动电力调节和转换、能量存储、航空航天分布式控制系统、深井地热能和国防应用的电子技术的发展。除了热弹性，新一代II类陶瓷电容器还必须在高电压下可靠和安全地运行，这对电力和储能应用尤其重要。该项目的主要目标是促进粒子气溶胶沉积(AD)作为新一代基于新型碱土偏铌酸盐介质陶瓷的电容器的产品开发和制造工具。我们将演示单室、多喷嘴顺序沉积介质和电极材料，以及复杂的工艺控制，以制造包括陶瓷、金属和聚合物材料的多层结构。将研究良性电容器故障模式，利用AD用于室温制造和材料集成的独特能力。AD可获得的高陶瓷密度和10纳米尺度的孔径，再加上没有热致陶瓷缺陷(因为我们选择了介电材料，避免了高温烧结)，提供了现有材料和制造程序无法达到的性能水平。该项目的关键组成部分包括：使用级联反应器对超细粉末进行快速成分原型的连续颗粒制造；用于细化颗粒结构的气流粉碎；支持AD工艺开发的计算流体力学；针对新型介质材料的AD参数的实验优化；电力电子转换器中新电容器的评估。了解制造条件和产品性能之间的相互作用是这一多学科项目的基本要素。气溶胶沉积避免了与高温处理相关的一系列问题，这些问题会降低介电陶瓷的性能。这条未来的制造路线与单层、毫米级厚度和具有1微米元件层的多层电容器相关。在可扩展的制造过程中，沉积速度超过每分钟10微米，这为集成各种热不同材料的长期挑战提供了解决方案。该方法为将其转化为工业制造环境提供了令人兴奋的可能性，为基于宽带隙半导体电子的新兴领域带来了优势。该项目将使用曼彻斯特大学专注于行业的气溶胶沉积制造研究设施，这是英国第一个由亨利·罗伊斯研究所资助的此类设施。

Robust dielectric charge storage devices offering reliable operation at high voltage and temperature are required for power electronics in renewable energy and for harsh environment electronics. A revolution has already taken place in wide band gap semiconductors, interconnects and high-temperature packaging, allowing operation at temperatures of 300C. Similar breakthroughs have yet to be made in dielectric charge storage technology: overcoming this barrier would advance electronics for power conditioning and conversion, energy storage, aerospace distributed control systems, deep well geothermal energy and defence applications. As well as thermal resilience, the new generation of Class II ceramic capacitors must operate reliably and safely at high voltages, especially important for power and energy storage applications. The main goal of the project is to advance particle aerosol deposition (AD) as a product development and manufacturing tool for a new generation of capacitors based on novel alkaline earth meta-niobate dielectric ceramics. We will demonstrate single-chamber, multi-nozzle sequential deposition of dielectric and electrode materials, with sophisticated process control to fabricate multilayer structures comprising ceramic, metal and polymer materials. Benign capacitor failure modes will be investigated, exploiting the unique capabilities of AD for room-temperature fabrication and materials integration. The high ceramic densities and 10 nm scale pore sizes attainable by AD, together with an absence of thermally induced ceramic defects (because of our selection of dielectric material and avoidance of high temperature sintering) offers to realise performance levels unattainable from existing materials and manufacturing procedures. Key components of the project are: continuous particle manufacture using cascade reactors for rapid compositional prototyping of ultrafine powders; jet milling for refinement of particle structure; computational fluid dynamics to support AD process development; experimental optimisation of AD parameters for the new dielectric materials; evaluation of the new capacitors in a power electronic converter. Understanding the interplay between manufacturing conditions and product properties is an essential element of this multidisciplinary project. Aerosol deposition avoids a range of problems associated with high temperature processing that degrade dielectric ceramic performance. This future manufacturing route is relevant to single layer, mm scale thickness, and multilayer capacitors with > 1 um component layers. Deposition rates in excess of 10 um per min within a scalable manufacturing process offer a solution to the long-standing challenge of integrating a wide range of thermally dissimilar materials. The approach offers exciting possibilities for translatiion into an industrial manufacturing context, bringing advantages to the emergent field of wide band gap semiconductor based electronics.The project will use the industry-focussed aerosol deposition manufacturing research facility at Manchester University, the first of its kind in the UK, funded by the Henry Royce Institute.