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Silicon pixel detectors for Synchrotron beam lines

用于同步加速器光束线的硅像素探测器

基本信息

批准号：
ST/H000623/1
负责人：
金额：
$ 9.59万
依托单位：
University of Glasgow
依托单位国家：
英国
项目类别：
Training Grant
财政年份：
2009
资助国家：
英国
起止时间：
2009 至无数据
项目状态：
已结题

来源：
https://gtr.ukri.org/projects?ref=ST%2FH000623%2F1
关键词：
Silicon pixel detectors Synchrotron beam

项目摘要

The project aims to build on existing work in the University of Glasgow and Diamond detector development group to investigate novel silicon pixel detector architectures applicable to use at the Diamond Synchrotron. The student will work in the Glasgow detector development group with Dr Richard Bates (head of 3D detector group in the RD50 collaboration) and Dr Andrew Blue (expert on APS sensor testing), and in the Diamond Detector group with Dr Nicola Tartoni (head of Diamond detector group) and Dr Julien Marchal (detector expert with particular responsibility for organising testbeam activities in this project). The supervising academic staff member will be Dr Chris Parkes (head of Glasgow RD50 activities). Two technologies will be investigated: 1) Small dimension hybrid pixel devices with reduced charge sharing for use on 10-20 KeV X-ray beam lines 2) Active pixel sensors for soft x-ray diffraction, and high energy beam line real-time applications. The student will primarily concentrate on detector testing and characterisation, both in the Glasgow laboratory and on Diamond beamlines. Device modeling will be performed to underpin the analysis of the results. The student will spend part of their time at the University of Glasgow and part at the Diamond Synchrotron, depending on the project needs. The student will undertake the relevant PhD training courses at the University of Glasgow. 1) Hybrid Pixel Devices Currently existing commercial hybrid pixel devices are based on 170x170 micron pixels (in the state-of-the-art Pilatus system used at Diamond). At Diamond the needs for smaller pixel size silicon sensors have been clearly identified. Both the University of Glasgow and Diamond are members of the Medipix collaboration which produces single photon counting 55x55 micron pixel readout front-end electronics. However, conventional small pixel planar devices suffer from charge sharing between pixels. This can be addressed through either the use of 3D sensors to limit charge sharing or in the electronic read-out chip (or both). 3D sensors: This work builds on the highly successful previous CASE studentship which resulted in the design, simulation and first production of a novel 3D detector architecture sensor and the first 3D detector for synchrotron applications. These tests have demonstrated significantly reduced charge sharing. 3D fabrication techniques (applied to either 3D detectors or planar detectors) can yield edgeless devices which allow tiling of devices over an area, of obvious application to imaging at Diamond, and will be considered in a future production. Read-out Chip: The Medipix3 readout chip will soon be available which will attempt to reduce charge sharing through the electronic circuitry. The charge sharing in a conventional (as well as 3D) device will be compared against Medipix2. 2) APS Development Active pixel sensors (APS) have the key advantage over CCD devices that are conventionally used in Synchrotron applications, which is that the APS in-pixel electronics is configurable for the required application. At Diamond this has potential applications on soft X-ray diffraction beamlines (I10, I06) and, coupled with a scintillator, on High Energy beamlines (I15 and I12). Large area devices suitable for Synchrotron applications are producible from APS technology, and APS sensors can be readout with a high frame rate The University of Glasgow group, as part of MI3, has developed a setup and techniques for the characterisation of APS sensors. In recent years this has been applied to the characterisation of 4 types of APS sensor with dimensions from 45 micron down to 6 micron. APS sensors suitable for application at Diamond are already extant and will be tested in the early part of this CASE studentship. This initial study is likely to result (with additional grant applications) in suggestions to produce large area low noise APS sensors ideally tailored to Diamond applications.

该项目的目的是建立在现有的工作在格拉斯哥大学和钻石探测器开发小组，研究新的硅像素探测器架构适用于在钻石同步加速器。学生将在格拉斯哥探测器开发组与理查德·贝茨博士（RD 50合作中的3D探测器组负责人）和安德鲁·布鲁博士（APS传感器测试专家）一起工作，并在钻石探测器组与尼古拉·塔尔托尼博士（钻石探测器组负责人）和朱利安·马夏尔博士（特别负责组织该项目中的测试束活动的探测器专家）一起工作。监督学术人员将克里斯·帕克斯博士（格拉斯哥RD 50活动负责人）。将研究两种技术：1）用于10-20 KeV X射线束线的具有减少的电荷共享的小尺寸混合像素器件2）用于软X射线衍射和高能束线实时应用的有源像素传感器。学生将主要集中在探测器测试和表征，无论是在格拉斯哥实验室和钻石光束线。将进行器械建模，以支持结果分析。根据项目需要，学生将在格拉斯哥大学和钻石同步加速器度过一部分时间。学生将在格拉斯哥大学接受相关的博士培训课程。1)混合像素设备目前现有的商用混合像素设备基于170 x170微米像素（在Diamond使用的最先进的Pilatus系统中）。在钻石的需要更小的像素尺寸的硅传感器已明确确定。格拉斯哥大学和Diamond都是Medipix合作项目的成员，该项目生产单光子计数55x 55微米像素读出前端电子产品。然而，传统的小像素平面器件遭受像素之间的电荷共享。这可以通过使用3D传感器来限制电荷共享或在电子读出芯片中（或两者）来解决。3D传感器：这项工作建立在以前非常成功的CASE学生的基础上，该学生设计，模拟和首次生产了一种新型3D探测器结构传感器和第一个用于同步加速器应用的3D探测器。这些测试表明电荷共享显著减少。3D制造技术（应用于3D探测器或平面探测器）可以产生无边缘设备，允许在一个区域上平铺设备，在Diamond成像中有明显的应用，并将在未来的生产中考虑。读出芯片：Medipix 3读出芯片将很快上市，它将试图通过电子电路减少电荷共享。将传统（以及3D）器械中的电荷共享与Medipix 2进行比较。2)APS开发有源像素传感器（APS）相对于同步加速器应用中传统使用的CCD器件具有关键优势，即APS像素内电子器件可根据所需应用进行配置。在Diamond，这在软X射线衍射光束线（I10，I 06）上具有潜在的应用，并且与闪烁体相结合，在高能光束线（I15和I12）上具有潜在的应用。适用于同步加速器应用的大面积器件可由APS技术生产，APS传感器可以以高帧率读出。作为MI 3的一部分，格拉斯哥大学小组开发了一种用于表征APS传感器的设置和技术。近年来，这已被应用于4种类型的APS传感器的表征，尺寸从45微米到6微米。APS传感器适用于钻石的应用已经存在，并将在本案例的早期部分进行测试。这项初步研究可能会导致（与额外的赠款申请）的建议，以生产大面积低噪声APS传感器理想地定制钻石应用。