Silicon pixel detectors for Synchrotron beam lines

用于同步加速器光束线的硅像素探测器

基本信息

批准号：
ST/H000623/1
负责人：
金额：
$ 9.59万
依托单位：
University of Glasgow
依托单位国家：
英国
项目类别：
Training Grant
财政年份：
2009
资助国家：
英国
起止时间：
2009 至无数据
项目状态：
已结题

来源：
https://gtr.ukri.org/projects?ref=ST%2FH000623%2F1
关键词：
Silicon pixel detectors Synchrotron beam

项目摘要

The project aims to build on existing work in the University of Glasgow and Diamond detector development group to investigate novel silicon pixel detector architectures applicable to use at the Diamond Synchrotron. The student will work in the Glasgow detector development group with Dr Richard Bates (head of 3D detector group in the RD50 collaboration) and Dr Andrew Blue (expert on APS sensor testing), and in the Diamond Detector group with Dr Nicola Tartoni (head of Diamond detector group) and Dr Julien Marchal (detector expert with particular responsibility for organising testbeam activities in this project). The supervising academic staff member will be Dr Chris Parkes (head of Glasgow RD50 activities). Two technologies will be investigated: 1) Small dimension hybrid pixel devices with reduced charge sharing for use on 10-20 KeV X-ray beam lines 2) Active pixel sensors for soft x-ray diffraction, and high energy beam line real-time applications. The student will primarily concentrate on detector testing and characterisation, both in the Glasgow laboratory and on Diamond beamlines. Device modeling will be performed to underpin the analysis of the results. The student will spend part of their time at the University of Glasgow and part at the Diamond Synchrotron, depending on the project needs. The student will undertake the relevant PhD training courses at the University of Glasgow. 1) Hybrid Pixel Devices Currently existing commercial hybrid pixel devices are based on 170x170 micron pixels (in the state-of-the-art Pilatus system used at Diamond). At Diamond the needs for smaller pixel size silicon sensors have been clearly identified. Both the University of Glasgow and Diamond are members of the Medipix collaboration which produces single photon counting 55x55 micron pixel readout front-end electronics. However, conventional small pixel planar devices suffer from charge sharing between pixels. This can be addressed through either the use of 3D sensors to limit charge sharing or in the electronic read-out chip (or both). 3D sensors: This work builds on the highly successful previous CASE studentship which resulted in the design, simulation and first production of a novel 3D detector architecture sensor and the first 3D detector for synchrotron applications. These tests have demonstrated significantly reduced charge sharing. 3D fabrication techniques (applied to either 3D detectors or planar detectors) can yield edgeless devices which allow tiling of devices over an area, of obvious application to imaging at Diamond, and will be considered in a future production. Read-out Chip: The Medipix3 readout chip will soon be available which will attempt to reduce charge sharing through the electronic circuitry. The charge sharing in a conventional (as well as 3D) device will be compared against Medipix2. 2) APS Development Active pixel sensors (APS) have the key advantage over CCD devices that are conventionally used in Synchrotron applications, which is that the APS in-pixel electronics is configurable for the required application. At Diamond this has potential applications on soft X-ray diffraction beamlines (I10, I06) and, coupled with a scintillator, on High Energy beamlines (I15 and I12). Large area devices suitable for Synchrotron applications are producible from APS technology, and APS sensors can be readout with a high frame rate The University of Glasgow group, as part of MI3, has developed a setup and techniques for the characterisation of APS sensors. In recent years this has been applied to the characterisation of 4 types of APS sensor with dimensions from 45 micron down to 6 micron. APS sensors suitable for application at Diamond are already extant and will be tested in the early part of this CASE studentship. This initial study is likely to result (with additional grant applications) in suggestions to produce large area low noise APS sensors ideally tailored to Diamond applications.

该项目旨在以格拉斯哥大学和钻石探测器开发小组的现有工作为基础，以调查适用于钻石同步物使用的新型硅像素探测器体系结构。该学生将与理查德·贝茨（Richard Bates）博士（RD50合作中的3D探测器组负责人）和安德鲁·蓝（Andrew Blue）（Andrew Blue博士）（APS传感器测试的专家）一起在格拉斯哥探测器开发小组中工作，以及与Nicola Tartoni博士（Diamond Detector Group的负责人）和钻石探测器组（Dimola Tartoni（Diamond Detector Group）的负责人）和julien Marchal博士（Derctector Expert of Julien Marchal（特定负责）对有组织测试的项目，该项目在此项目中进行了调查。监督学者的工作人员将是克里斯·帕克斯（Chris Parkes）博士（格拉斯哥RD50活动负责人）。将研究两种技术：1）在10-20 KeV X射线光束线2）用于软X射线衍射的主动像素传感器以及高能光束线实时应用。在格拉斯哥实验室和钻石束线上，学生将主要集中于检测器测试和表征。将执行设备建模以支持结果的分析。根据项目需求，学生将在格拉斯哥大学度过一部分时光，并在钻石同步子上度过一部分。该学生将在格拉斯哥大学举办相关的博士培训课程。 1）当前现有的商业混合像素设备的混合像素设备基于170x170微米像素（在Diamond使用的最先进的Pilatus系统中）。在钻石上，已经清楚地发现了较小的像素尺寸硅传感器的需求。格拉斯哥大学和钻石大学都是Medipix合作的成员，该协作产生了单个光子计数55x55微米像素读数前端电子产品。但是，常规的小像素平面设备会遭受像素之间的电荷共享。可以通过使用3D传感器来限制电荷共享或在电子读出芯片（或两者）中解决这。 3D传感器：这项工作建立在非常成功的先前案例学生奖学金的基础上，该案例的设计，模拟和首次生产的新型3D检测器体系结构传感器和同步器应用程序的第一个3D检测器。这些测试表明电荷共享大大减少。 3D制造技术（应用于3D探测器或平面检测器）可以产生无端的设备，这些设备允许设备在钻石上明显适用于成像的区域，并将在未来的生产中进行考虑。读取芯片：Medipix3读取芯片将很快可用，这将尝试通过电子电路减少电荷共享。将在常规（以及3D）设备中的电荷共享与Medipix2进行比较。 2）APS开发主动像素传感器（APS）具有比CCD设备的关键优势，而CCD设备通常用于Synchrotron应用程序中，这是APS内像素电子设备可用于所需的应用程序。在钻石上，这在软X射线衍射束线（I10，i06）上具有潜在的应用，并与闪烁体相结合，在高能梁线上（I15和I12）。适用于同步物应用的大型设备可从APS技术生产，并且可以使用高帧速率读取APS传感器作为MI3的一部分，Glasgow University of Glasgow Group已开发了一种用于表征APS传感器的设置和技术。近年来，这已应用于44个尺寸从45微米到6微米的4种类型的APS传感器的表征。适用于Diamond应用的APS传感器已经存在，将在本案学生资格的早期进行测试。这项最初的研究很可能会导致（以及其他赠款应用）在生产大面积的低噪声AP传感器的建议中，理想地针对钻石应用量身定制。