Detector development for future particle detectors with a focus on new technologies for the ATLAS experiment at the LHC

未来粒子探测器的探测器开发，重点是大型强子对撞机 ATLAS 实验的新技术

• 批准号: 2659507
• 金额: --
• 依托单位: University of Manchester
• 依托单位国家: 英国
• 项目类别: Studentship
• 财政年份: 2021
• 资助国家: 英国
• 起止时间: 2021 至 无数据
• 项目状态: 未结题
• 来源: https://gtr.ukri.org/projects?ref=studentship-2659507
• 关键词: Detector; development; future; particle; detectors

The project addresses one of the current challenges in high energy physics experiments: precision detection in both space and time or 4D tracking. All experiments at the CERN Large Hadron Collider will undergo upgrades in their systems to cope with the increased beam luminosities in the second half of this decade. The increased number of events will allow a larger statistic, with a consequent better probability of discoveries of new phenomena. The larger number of events, however, will also imply a larger overlap and an increase in radiation damage of the full detector system, in particular in the region closer to the interaction point. The Manchester group has pioneered the development and exploitation of 3D silicon sensors, which are now installed in the ATLAS Insertable B-Layer (IBL) and are planned for the upgraded Layer0 in 2027. 3D sensors, fabricated using Micro-Electro-Mechanical System (MEMS) technology, are processed with p- and n- electrodes inside the silicon bulk. This geometry has shown to be particularly suited for radiation tolerance and fast signal response. An evolution of the 3D geometry with trench electrodes combined with a new generation of front-end electronics chips are being studied to provide the required precision in space and time (<10 microns and <10 picoseconds) together with the necessary radiation tolerance >2x1016 ncm-2 for possible upgrades beyond 2027. The main objectives of the project are: - Precision tracking using traditional 3D silicon sensors bump-bonded to the Timepix3 readout electronics chip. The Timepix3 readout has a pixel size of 55x55 microns squared, a response of 2ns and Time of Arrival (ToA) functionality.- Precision tracking using traditional 3D silicon sensors bump-bonded to the Timepix4 readout electronics chip. The Timepix4 readout has a pixel size of 55x55 microns squared, a response of 200ps and is becoming available for bump bonding.- Precision tracking using 3D silicon with trench-electrodes and a dedicated readout electronics. 3D with trench electrodes have been fabricated and preliminary tests are very encouraging. Tests with single channel readout electronics have shown a response of ~6 ps

该项目解决了高能物理实验中当前的挑战之一：空间和时间的精确检测或4D跟踪。欧洲核子研究中心大型强子对撞机的所有实验都将在其系统中进行升级，以科普本十年后半期增加的光束亮度。事件数量的增加将允许更大的统计数据，从而更有可能发现新现象。然而，大量的事件也意味着更大的重叠和整个探测器系统的辐射损害的增加，特别是在更靠近相互作用点的区域。曼彻斯特集团率先开发和利用了3D硅传感器，这些传感器目前已安装在ATLAS可插入B层（IBL）中，并计划于2027年用于升级后的Layer 0。使用微机电系统（MEMS）技术制造的3D传感器在硅块体内部加工有p电极和n电极。这种几何形状已被证明特别适合于辐射耐受性和快速信号响应。正在研究将沟槽电极与新一代前端电子芯片相结合的3D几何结构的演变，以提供所需的空间和时间精度（<10微米和<10皮秒）以及必要的辐射容限> 2x 1016 ncm-2，以便在2027年之后进行升级。该项目的主要目标是：-使用传统的3D硅传感器凸点键合到Timepix 3读出电子芯片进行精确跟踪。Timepix 3读出具有55x 55平方微米的像素大小，2ns的响应和到达时间（ToA）功能。使用传统的3D硅传感器凸点键合到Timepix 4读出电子芯片进行精确跟踪。Timepix 4读出器的像素尺寸为55x 55平方微米，响应为200 ps，并且可用于凸点焊接。使用带有沟槽电极和专用读出电子器件的3D硅进行精确跟踪。已经制造了具有沟槽电极的3D，并且初步测试非常令人鼓舞。用单通道读出电子器件进行的测试表明，响应时间约为6 ps