权益分类	功能权益	普通用户	{{item.name}}会员
{{category.name}}	{{benefitItem.name}}

Dual Source Pulsed Plasmas for the Production of Ultra-High Performance Coatings

用于生产超高性能涂层的双源脉冲等离子体

基本信息

批准号：
EP/E003133/1
负责人：
Peter Kelly
金额：
$ 25.02万
依托单位：
Manchester Metropolitan University
依托单位国家：
英国
项目类别：
Research Grant
财政年份：
2007
资助国家：
英国
起止时间：
2007 至无数据
项目状态：
已结题

来源：
https://gtr.ukri.org/projects?ref=EP%2FE003133%2F1
关键词：
Dual Source Pulsed Plasmas Production

项目摘要

Pulsed processing has initiated a new era in surface engineering technologies. For example, pulsed magnetron sputtering has transformed the deposition of dielectric materials. The benefits of pulsed processing can be further capitalised on through the application of mid-frequency pulsed DC power at the substrate. This 'dual source' sputtering mode uses one pulsed power source to generate a plasma in front of the target and a second, similar, source to excite a plasma in front of the substrate. This enables the deposition conditions at the substrate to be controlled independent of the sputtering conditions in a flexible and versatile manner. This offers a new and exciting means of controlling the energy delivered to the substrate during film deposition, which is a critical factor in determining the microstructures and properties of magnetron sputtered coatings. To date, this technique has been largely overlooked. We aim, therefore, to perform the first detailed study of this technique, with a view to producing ultra-high performance coatings, particularly aimed at applications such as dry machining and dry-running components, where environmental pressures to reduce the use of hydrocarbon lubricants demand coatings with properties that present technologies are struggling to deliver.We will investigate the use of dual source discharges in the enhancement and control of the ion-to-atom ratio incident at the substrate during deposition and the effectiveness of the ion etch process prior to deposition. However, in order to exploit the full potential of this new technique, it will also be necessary to undertake detailed measurements of the plasma. Thus, this study will also lead to the advancement of plasma measurement techniques in pulsed discharges. The information gained will allow us to determine the interrelationships between the driving voltage waveforms at the targets and at the substrate and the nature of the multi-excited discharge that forms, and their combined impact on film growth.

脉冲处理开创了表面工程技术的新纪元。例如，脉冲磁控溅射改变了电介质材料的沉积。通过在衬底上应用中频脉冲直流电源，可以进一步利用脉冲处理的好处。这种“双源”溅射模式使用一个脉冲电源在靶面产生等离子体，另一个类似的脉冲电源在衬底前面激发等离子体。这使得能够以灵活和通用的方式独立于溅射条件来控制衬底上的沉积条件。这提供了一种新的令人兴奋的方法来控制在薄膜沉积过程中传递到衬底的能量，这是决定磁控溅射涂层组织结构和性能的关键因素。到目前为止，这种技术在很大程度上被忽视了。因此，我们的目标是对这项技术进行第一次详细的研究，以期生产超高性能的涂层，特别是针对诸如干加工和干运转部件等应用，在这些应用中，减少碳氢润滑剂使用的环境压力要求涂层具有目前技术难以提供的性能。我们将研究双源放电在提高和控制沉积过程中入射到衬底的离子原子比中的使用，以及沉积前离子刻蚀过程的有效性。然而，为了充分发挥这项新技术的潜力，还需要对等离子体进行详细的测量。因此，这项研究也将促进脉冲放电等离子体测量技术的进步。获得的信息将使我们能够确定目标和衬底上的驱动电压波形之间的相互关系，以及形成的多激发放电的性质，以及它们对薄膜生长的综合影响。