Optimizing flexible, active electrode arrays for chronic, large-scale recording and stimulation on the scale of 100,000 electrodes

摘要 在该提案中，我们将开发下一代灵活的微型皮质电图（µECoG）和穿透式 在互补金属氧化物半导体（CMOS）技术中使用有源电子器件的电极阵列。 有源电子器件能够直接在每个电极处进行放大和多路复用， 植入的电极被单独地连接到远程电子设备，并大大增加了数量， 可以记录和刺激的电极密度。我们阵列的灵活性使其能够符合 大脑的不规则几何形状，产生更高保真的信号，并减少对大脑的损伤， 用于穿透配置。集成的无线数据和电源可实现完全无线连接 植入物.总之，这些创新使我们能够在大面积的环境中进行高分辨率测量。 大脑，同时具有较低的侵入性，这是对当前最先进技术的实质性改进。 在表面记录结构中，我们将演示多达65，536个电极的电极阵列， 放大器，间距仅为25.4µm，每个电极可以以20 ksps的速度同时采样， 在64 mm²的大脑区域内实现了细胞分辨率的大脑接口。每个电极也可以 独立刺激，或用激活模式刺激，模仿更自然的兴奋模式。 在穿透阵列，我们将展示完全集成，灵活的穿透神经探针，高达512 每柄电极数。包含有源电子器件的探针“头”将折叠在探针的外表面上。 皮质，在探针的插入点，定位其感应器，以通过头骨进行近场连接。这 链路将通过近场射频数据遥测技术无线供电，从而消除了有线运行的需要 连接在一起与无线接口的集成将允许长期密封- 植入式探针皮下植入，并且以整个探针漂浮在大脑上的方式植入。 开发的技术将在体外和体内进行严格测试。该项目将使高 基于可制造的柔性CMOS技术的高密度电极阵列， 神经科学界，使大规模的记录和调制在神经系统的研究。的 通过这项工作产生的创新有可能彻底改变我们理解大脑的能力， 并将改善癫痫手术的结果，以及提高运动和听觉的表现， 修复术. 该项目利用了临床医生，工程师，材料 杜克大学、哥伦比亚大学、纽约大学和 伊利诺伊大学厄巴纳-香槟分校，将主动，灵活的电子技术转化为下一代 可植入的神经系统装置

Abstract In this proposal, we will develop next-generation flexible micro-electrocortigraphic (µECoG) and penetrating electrode arrays using active electronics in complementary metal-oxide-semiconductor (CMOS) technology. Active electronics enable amplification and multiplexing directly at each electrode, eliminating the need for implanted electrodes to be individually wired to remote electronics and greatly increasing the number and density of electrodes that can be recorded and stimulated. The flexibility of our arrays allows them to conform to the irregular geometry of the brain, yielding higher fidelity signals and reduces damage to the brain when used in penetrating configurations. Integrated wireless data and power enables completely tether-free implants. Together, these innovations enable us to take high resolution measurements over large areas of the brain while being less invasive, a substantial improvement over the current state-of-the-art. In surface recording structures, we will demonstrate electrode arrays of up to 65,536 electrodes and amplifiers, spaced just 25.4µm apart, where each electrode can be simultaneously sampled at 20 ksps, enabling a cellular-resolution brain interface across a 64 mm² brain area. Each electrode can also be independently stimulated, or stimulated with patterns of activation, mimicking more natural excitation patterns. In penetrating arrays, we will demonstrate fully integrated, flexible penetrating neural probes with up to 512 electrodes per shank. The probe “head” containing active electronics will fold over the outer surface of the cortex, at the point of the probe’s insertion, positioning its inductor for a near-field link through the skull. This link will be powered wirelessly with near-field radio-frequency data telemetry, eliminating the need to run wired interconnections through the skull. Integration with wireless interfaces will permit sealing chronically- implantable probes subcutaneously and in a manner in which the entire probe floats on the brain. The developed technologies will be rigorously tested in vitro and in vivo. This project will make high density electrode arrays based on manufacturable flexible CMOS technology available for the broader neuroscience community, enabling studies of large-scale recording and modulation in the nervous system. The innovations generated through this work have the potential to revolutionize our ability to understand the brain, and will improve epilepsy surgery outcomes as well as advance the performance of motor and auditory prosthetics. This project leverages a successful, long-term collaboration between clinicians, engineers, material scientists and neuroscientists at Duke University, Columbia University, New York University and the University of Illinois at Urbana-Champaign, to translate active, flexible electronics technology into next generation implantable neurological devices.