Optimizing flexible, active electrode arrays for chronic, large-scale recording and stimulation on the scale of 100,000 electrodes

摘要 在这项计划中，我们将开发下一代柔性微皮质电成像(µECoG)和穿透式 在互补金属氧化物半导体(CMOS)技术中使用有源电子技术的电极阵列。 有源电子技术可以直接在每个电极上进行放大和多路传输，从而不需要 植入的电极将单独连接到远程电子设备，并极大地增加了 可记录和刺激的电极密度。我们阵列的灵活性使他们能够符合 大脑的不规则几何结构，产生更高的保真度信号，并减少对大脑的损害 用于穿透配置。集成无线数据和电源，实现完全无系绳 植入物。总而言之，这些创新使我们能够在大片地区进行高分辨率测量 大脑的侵入性更小，比目前最先进的水平有了实质性的改进。 在表面记录结构中，我们将演示多达65,536个电极的电极阵列和 放大器的间距仅为25.4微米，每个电极可同时以20 kSPS的速度采样， 使细胞分辨率脑部接口能够跨越mm？脑区。每个电极还可以 独立刺激，或用激活模式刺激，模仿更自然的兴奋模式。 在穿透阵列中，我们将展示高达512个的完全集成、灵活的穿透神经探头 每个小腿的电极数。含有有源电子的探头“头”将折叠在 大脑皮层，在探头的插入点，定位其感应器，以便通过头骨进行近场连接。这 Link将通过近场射频数据遥测无线供电，不再需要有线运行 通过头骨相互连接。与无线接口的集成将允许长期密封- 可植入的探头在皮下，整个探头漂浮在大脑上。 开发的技术将在体外和体内进行严格的测试。这个项目将取得很高的成绩。 基于可制造的柔性CMOS工艺的密度电极阵列可用于更广泛的领域 神经科学界，使神经系统中大规模记录和调制的研究成为可能。这个 通过这项工作产生的创新有可能彻底改变我们理解大脑的能力， 并将改善癫痫的手术结果以及提高运动和听觉的表现 假肢。 该项目充分利用了临床医生、工程师、材料 杜克大学、哥伦比亚大学、纽约大学和纽约大学的科学家和神经学家 在伊利诺伊州的Urbana-Champaign，将活跃、灵活的电子技术转化为下一代 植入式神经装置。

Abstract In this proposal, we will develop next-generation flexible micro-electrocortigraphic (µECoG) and penetrating electrode arrays using active electronics in complementary metal-oxide-semiconductor (CMOS) technology. Active electronics enable amplification and multiplexing directly at each electrode, eliminating the need for implanted electrodes to be individually wired to remote electronics and greatly increasing the number and density of electrodes that can be recorded and stimulated. The flexibility of our arrays allows them to conform to the irregular geometry of the brain, yielding higher fidelity signals and reduces damage to the brain when used in penetrating configurations. Integrated wireless data and power enables completely tether-free implants. Together, these innovations enable us to take high resolution measurements over large areas of the brain while being less invasive, a substantial improvement over the current state-of-the-art. In surface recording structures, we will demonstrate electrode arrays of up to 65,536 electrodes and amplifiers, spaced just 25.4µm apart, where each electrode can be simultaneously sampled at 20 ksps, enabling a cellular-resolution brain interface across a 64 mm² brain area. Each electrode can also be independently stimulated, or stimulated with patterns of activation, mimicking more natural excitation patterns. In penetrating arrays, we will demonstrate fully integrated, flexible penetrating neural probes with up to 512 electrodes per shank. The probe “head” containing active electronics will fold over the outer surface of the cortex, at the point of the probe’s insertion, positioning its inductor for a near-field link through the skull. This link will be powered wirelessly with near-field radio-frequency data telemetry, eliminating the need to run wired interconnections through the skull. Integration with wireless interfaces will permit sealing chronically- implantable probes subcutaneously and in a manner in which the entire probe floats on the brain. The developed technologies will be rigorously tested in vitro and in vivo. This project will make high density electrode arrays based on manufacturable flexible CMOS technology available for the broader neuroscience community, enabling studies of large-scale recording and modulation in the nervous system. The innovations generated through this work have the potential to revolutionize our ability to understand the brain, and will improve epilepsy surgery outcomes as well as advance the performance of motor and auditory prosthetics. This project leverages a successful, long-term collaboration between clinicians, engineers, material scientists and neuroscientists at Duke University, Columbia University, New York University and the University of Illinois at Urbana-Champaign, to translate active, flexible electronics technology into next generation implantable neurological devices.