Universal chip-chip bonder

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Microfluidic devices and cell culture platforms equipped with microsensors or microelectrodes are often made of two chips both of which are microstructured. Typically, a microfluidic component is patterned on the top plate, whereas microsensors or microelectrodes are structured on the bottom plate. The requested universal chip-chip bonder will allow the accurate alignment and the bonding of these devices. The dimensions of the chips will range from 3 x 3 mm to 20 x 20 mm. The following types of bonding will be possible: anodic bonding, PDMS-glass sealing, thermofusion bonding and gluing.