Universal chip-chip bonder

配有微传感器或微电极的微流控器件和细胞培养平台通常由两个芯片组成，这两个芯片都是微结构的。通常，微流控部件图案化在顶板上，而微传感器或微电极结构在底板上。所要求的通用芯片-芯片焊接机将允许这些器件的精确对准和焊接。芯片的尺寸将从3x3毫米到20x20毫米不等。以下类型的粘接将是可能的：阳极粘接、PDMS-玻璃密封、热熔接和粘接。

Microfluidic devices and cell culture platforms equipped with microsensors or microelectrodes are often made of two chips both of which are microstructured. Typically, a microfluidic component is patterned on the top plate, whereas microsensors or microelectrodes are structured on the bottom plate. The requested universal chip-chip bonder will allow the accurate alignment and the bonding of these devices. The dimensions of the chips will range from 3 x 3 mm to 20 x 20 mm. The following types of bonding will be possible: anodic bonding, PDMS-glass sealing, thermofusion bonding and gluing.