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Integration of micro-sensors with MEMS devices for microassembly and micromanipulation

Integration of micro-sensors with MEMS devices for microassembly and micromanipulation
微传感器与 MEMS 器件集成,用于微组装和微操作
批准号:
327081-2006
负责人:
Lai, Yongjun
金额:
$1.24万
依托单位:
依托单位国家:
加拿大
项目类别:
Discovery Grants Program - Individual
财政年份:
2007
资助国家:
加拿大
项目状态:
已结题
起止时间:
2007-01-01 至 2008-12-31

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中文摘要
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英文摘要
Recent development of Micro-Electro-Mechanical Systems (MEMS) has made it possible to integrate them in such fields as transportation, medicine and health care. MEMS complement and in some cases improve traditional devices. One particular area that has been steadily gaining significance in recent years is the field of so-called "Bio-MEMS"; it integrates MEMS technology with biomedical platforms. Recent challenges in the Bio-MEMS area stem from a need for biomanipulation and microassembly. In particular, feed-back sensor-based manipulations are necessary to realize efficient and reliable handling of micro-objects in different environments. This study investigates the development of MEMS devices with embedded capacitive comb-drive sensors with the objective of facilitating microassembly, micromanipulation and biomedical applications. In the proposed research novel micro capacitive comb-drive sensors with capability to reconfigure will be developed. The proposed sensors will be reconfigured by novel active (powered)/passive latching mechanisms. Through reconfiguration, such sensors will gain high sensitivity, large measurement range and good linearity (which existing ones lack). New reconfigurable electrostatic linear comb-drive actuators will be developed which will reduce the high drive voltage required by traditional counterparts and consequently make it possible to integrate improved comb-drive actuators with low voltage CMOS (Complementary Metal Oxide Semiconductor) circuits in the future.  As an integral part, original MEMS mechanisms, such as, microprobes, micro tissue/cell micromanipulators will be developed and integration of the proposed sensors with these devices will be studied. This project accumulates experience on integrated MEMS sensors with other monolithically fabricated MEMS devices. The results obtained will be valuable for the future research on integrated MEMS and CMOS signal conditioning circuits.  In the last stage of the project, the proposed devices will be incorporated into practical applications. The success of the project will pave the way to MEMS integration, modularization and commercialization and significantly advance the field in Canada.
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