Development of MEMS micro-integration technologies: application to sensors

MEMS微集成技术的发展：在传感器中的应用

• 批准号: 327606-2006
• 负责人: Dechev, Nikolai
• 金额: $ 1.38万
• 依托单位: University of Victoria
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2008
• 资助国家: 加拿大
• 起止时间: 2008-01-01 至 2009-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=397864
• 关键词: Development; MEMS; micro; integration; technologies

This research will develop new micro-integration technologies that are required to combine various types of micro-devices and MEMS (micro-electromechanical systems) together into complete, self-contained microsystems.  The micro-integration technologies to be developed are hybrid microassembly, micro-interfacing and micro-packaging.  The unifying aim and long term objective of these technologies is to apply them to self-contained, millimeter-scale microsystems, such as micro-sensors.  Such micro-sensors can provide for exciting new applications in the areas of biomedical devices and smart materials.  The hybrid microassembly research aims to combine serial-robotic assembly technology together with self-assembly technology.  The objective is to increase the microassembly rate, while allowing for complex microstructures to be assembled.  The micro-interfacing research aims to explore ways in which several out-of-plane micro-devices can be electrically connected together, using flexible silicon micro-wires or using micro-wire-welding techniques. The aim of the micro-packaging research is to explore new ways to package millimeter-scale or smaller microsystems, to protect them from adverse environmental conditions, while simultaneously allowing the active sensor elements to measure their surroundings. The objective of both the micro-interfacing research and the micro-packaging research, is to develop new technologies that did not previously exist. Taken together, the proposed micro-integration technologies will provide a significant advancement towards the creation of milli-scaled microsystems, and micro-sensors. If micro-sensors in the size range of a few cubic mm or smaller, can be achieved, they could have great application in areas such as biomedical implants for long term, internal bio-signal analysis, or embedded sensors in plastics for in-service performance analysis.

这项研究将开发新的微集成技术，需要联合收割机结合各种类型的微器件和MEMS微机电系统集成是一种新的集成技术，它将微机电系统集成为一个完整的、独立的微系统。微集成技术的发展方向是混合微组装、微接口和微封装。这些技术的统一目标和长期目标是将它们应用于独立的、毫米级微系统，如微传感器。这种微传感器可以在生物医学器件和智能材料领域提供令人兴奋的新应用。混合微装配研究旨在将联合收割机串联机器人装配技术与自装配技术相结合。目标是提高微装配速率，同时允许组装复杂的微结构。微接口研究旨在探索使用柔性硅微线或使用微线焊接技术将几个平面外的微器件电连接在一起的方法。微封装研究的目的是探索封装毫米级或更小微系统的新方法，以保护它们免受不利环境条件的影响，同时允许有源传感器元件测量其周围环境。微接口研究和微封装研究的目标是开发以前不存在的新技术。总的来说，所提出的微集成技术将为创建毫米级微系统和微传感器提供重大进展。如果可以实现几立方毫米或更小尺寸范围内的微传感器，它们可以在诸如用于长期的生物医学植入物、内部生物信号分析或用于使用中性能分析的塑料中的嵌入式传感器等领域中具有很大的应用。