Development of MEMS micro-integration technologies: application to sensors

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This research will develop new micro-integration technologies that are required to combine various types of micro-devices and MEMS (micro-electromechanical systems) together into complete, self-contained microsystems.  The micro-integration technologies to be developed are hybrid microassembly, micro-interfacing and micro-packaging.  The unifying aim and long term objective of these technologies is to apply them to self-contained, millimeter-scale microsystems, such as micro-sensors.  Such micro-sensors can provide for exciting new applications in the areas of biomedical devices and smart materials.  The hybrid microassembly research aims to combine serial-robotic assembly technology together with self-assembly technology.  The objective is to increase the microassembly rate, while allowing for complex microstructures to be assembled.  The micro-interfacing research aims to explore ways in which several out-of-plane micro-devices can be electrically connected together, using flexible silicon micro-wires or using micro-wire-welding techniques. The aim of the micro-packaging research is to explore new ways to package millimeter-scale or smaller microsystems, to protect them from adverse environmental conditions, while simultaneously allowing the active sensor elements to measure their surroundings. The objective of both the micro-interfacing research and the micro-packaging research, is to develop new technologies that did not previously exist. Taken together, the proposed micro-integration technologies will provide a significant advancement towards the creation of milli-scaled microsystems, and micro-sensors. If micro-sensors in the size range of a few cubic mm or smaller, can be achieved, they could have great application in areas such as biomedical implants for long term, internal bio-signal analysis, or embedded sensors in plastics for in-service performance analysis.