Practical approaches towards building nanoscale architechtures

构建纳米级架构的实用方法

• 批准号: 283291-2009
• 负责人: Buriak, Jillian
• 金额: $ 8.67万
• 依托单位: University of Alberta
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2012
• 资助国家: 加拿大
• 起止时间: 2012-01-01 至 2013-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=514678
• 关键词: Practical; approaches; towards; building; nanoscale

Nanostructures continue to be the focus of intense research because of their fascinating properties that can be distinctly different form their bulk counterparts, and thus show great promise for a range of applications. Complex metallic and organic architectures are emerging as important building blocks for on-chip interconnects and active components in nanoscale electronic, magnetic, photonic, and biosensing devices, for instance. One of the key ingredients required for these future applications is the ability to integrate numerous addressable nanostructures through assembly, patterning, and alignment on technologically relevant solid supports, such as semiconductor surfaces. The challenge lies in fabricating large areas of high density nanostructures, with feature sizes well below 100 nm, in an economically feasible manner. While photolithography will justifiably remain a core technology with respect to the upcoming sub-45 nm generations on the Semiconductor Industry Association (SIA) Roadmap, cost considerations for mass manufacturing will be one critical constraint. As a result, there is interest in the development of complementary patterning strategies that involve large scale self-assembly, for use as a soft organic template for nanostructure development. While block copolymer templating is suggested on the SIA Roadmap to be a potentially "innovative technology" for sub-45 nm feature patterning, there are still many challenges associated with their integration with silicon and other surfaces.

纳米结构仍然是深入研究的焦点，因为它们具有与块状结构截然不同的迷人特性，因此在一系列应用中显示出巨大的前景。例如，复杂的金属和有机结构正在成为纳米级电子、磁性、光子和生物传感设备中片上互连和有源元件的重要构建模块。 这些未来应用所需的关键要素之一是能够通过在技术相关的固体支撑物（例如半导体表面）上组装、图案化和对准来集成大量可寻址纳米结构。挑战在于以经济可行的方式制造大面积的高密度纳米结构，其特征尺寸远低于 100 nm。 虽然光刻技术理所当然地仍然是半导体工业协会 (SIA) 路线图上即将到来的 45 nm 以下世代的核心技术，但大规模制造的成本考虑将是一个关键限制。 因此，人们对开发涉及大规模自组装的互补图案化策略感兴趣，以用作纳米结构开发的软有机模板。虽然 SIA 路线图建议嵌段共聚物模板作为 45 nm 以下特征图案的潜在“创新技术”，但其与硅和其他表面的集成仍然存在许多挑战。