Novel Conductive Adhesives as a Lead-free and Multifunctional Joining Alternative for Electronic Packaging

新型导电粘合剂作为电子封装的无铅多功能连接替代品

• 批准号: 396849-2010
• 负责人: Zhao, Boxin
• 金额: $ 11.34万
• 依托单位: University of Waterloo
• 依托单位国家: 加拿大
• 项目类别: Strategic Projects - Group
• 财政年份: 2012
• 资助国家: 加拿大
• 起止时间: 2012-01-01 至 2013-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=515472
• 关键词: Novel; Conductive; Adhesives; Lead; free

As future technological innovations gear towards miniaturizing machines and maximizing performance density, effective joining of similar or dissimilar material components has become one of the most critical technical prerequisites for manufacturing at ever-smaller scales. This project focuses on the joining process in electronics manufacturing where lead-containing soldering technology has been the dominant technology. This conventional soldering technology is being challenged by the increasing demand from consumers for lighter and smaller devices, and the drive to eliminate the use of lead in electronic components due to its toxicity to humans and the environment. In this project, we work with three industrial partners, Celestica, Microbonds and Research In Motion, to develop novel conductive adhesives as a lead-free joining alternative to provide robust bonding and multifunctional properties. To achieve this technology, we have developed new concepts using high aspect-ratio or 1-D nanoscale fillers (nanowires and nanotubes) in conductive adhesives which will not only enhance the mechanical-thermal-electrical properties but also deliver such "smart" functions as self-sensing health monitoring to electronic devices. The cutting-edge research will generate new ideas and knowledge in the joining technology, and, through interactions and collaborations with the industrial sponsors, enable the development of new value-added joining technologies which use flexible, environmentally friendly and cost-effective materials and processes. This development will foster a vital competitive edge for the Canadian electronic industry in the international market place.

随着未来的技术创新转向机械化和性能密度最大化，相似或不同材料部件的有效连接已成为以更小规模制造的最关键技术先决条件之一。该项目的重点是电子制造业中的连接工艺，其中含铅焊接技术一直是主导技术。这种传统的焊接技术正受到消费者对更轻、更小设备的日益增长的需求的挑战，以及由于铅对人类和环境的毒性而在电子元件中消除铅的使用。在该项目中，我们与Celestica、Microbonds和Research In Motion三家工业合作伙伴合作，开发新型导电粘合剂作为无铅连接替代品，以提供强大的粘合和多功能特性。为了实现这项技术，我们开发了在导电粘合剂中使用高纵横比或1-D纳米级填料（纳米线和纳米管）的新概念，这不仅可以增强机械-热-电性能，还可以为电子设备提供自感知健康监测等“智能”功能。前沿研究将在连接技术方面产生新的想法和知识，并通过与工业赞助商的互动和合作，开发使用灵活，环保和具有成本效益的材料和工艺的新增值连接技术。这一发展将促进加拿大电子工业在国际市场上的重要竞争优势。