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Generic foundry platform for photonic integrated circuits in InP based on taper-assistant vertical integration technology

Generic foundry platform for photonic integrated circuits in InP based on taper-assistant vertical integration technology
基于锥度辅助垂直集成技术的 InP 光子集成电路通用代工平台
批准号:
505279-2016
负责人:
Dolgaleva, Ksenia
金额:
$1.82万
依托单位:
依托单位国家:
加拿大
项目类别:
Engage Grants Program
财政年份:
2016
资助国家:
加拿大
项目状态:
已结题
起止时间:
2016-01-01 至 2017-12-31

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中文摘要
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英文摘要
Photonic integration has been actively explored in optical communication networks over the past four decades. It serves as means for replacing a large number of bulk optical components, such as lasers, modulators, detectors, with a single photonic integrated circuit (PIC), offering small footprint size, high power efficiency, and superior performance stability.
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Integrated Photonics
  • 批准号:
    CRC-2020-00195
  • 项目类别:
    Canada Research Chairs
  • 资助金额:
    $7.29万
  • 财政年份:
    2022
  • 负责人:
    Dolgaleva, Ksenia
  • 依托单位:
III-V Semiconductor Platforms and Devices for Nonlinear Integrated Photonics
  • 批准号:
    RGPIN-2020-03989
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.04万
  • 财政年份:
    2022
  • 负责人:
    Dolgaleva, Ksenia
  • 依托单位:
Integrated Photonics
  • 批准号:
    CRC-2020-00195
  • 项目类别:
    Canada Research Chairs
  • 资助金额:
    $5.46万
  • 财政年份:
    2021
  • 负责人:
    Dolgaleva, Ksenia
  • 依托单位:
III-V Semiconductor Platforms and Devices for Nonlinear Integrated Photonics
  • 批准号:
    RGPIN-2020-03989
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.04万
  • 财政年份:
    2021
  • 负责人:
    Dolgaleva, Ksenia
  • 依托单位:
国内基金
海外基金
体硅下薄膜(TUB,Thinfilm Under Bulk)复合结构成型机理及其高性能器件研究