3D Single Photon Counting Modules for Radiation Instrumentation and Medical Imaging

用于辐射仪器和医学成像的 3D 单光子计数模块

• 批准号: RGPIN-2015-05001
• 负责人: Pratte, JeanFrancois
• 金额: $ 1.82万
• 依托单位: Université de Sherbrooke
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2017
• 资助国家: 加拿大
• 起止时间: 2017-01-01 至 2018-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=637192
• 关键词: 3D; Single; Photon; Counting; Modules

Optoelectronics systems have become the ubiquitous backbone of a multitude of applications, from smartphones and tablets to medical imaging instruments and telecommunication systems. They are in constant evolution, with performance improvement targets such as increasing the number of pixels, photodetection efficiency and timing measurement accuracy. Continuing impetus for growth is also provided by the integration of smart microsystems capable of total or partial signal processing from photodetectors. In that line of thought, optoelectronics microsystems integration and signal processing capability are starting to take advantage of the technological breakthroughs required to enable the “more than Moore’s law” in the field of microelectronics. One of those technological milestones is 3D vertical integration, where a minimum of 2 integrated circuits are stacked and interconnected using Through Silicon Vias (TSV). This proposal is about the realisation of 3D Single Photon Counting Modules, where an array of photodetectors is integrated on top of the required front-end microelectronic circuits. The targeted optoelectronics microsystem features single photon detection capability with single photon resolution, the ability to timestamp the arrival of the photons with very high accuracy and advanced digital signal processing. The challenging objective is to achieve a timing resolution in the range of 100 fs to 10 ps. For this, novel photodetector arrays and readout integrated circuits in deep-submicron CMOS technologies are required and are the core of the short term objectives of this research program. This work will lead to the next generation of detection modules that will be used in Positron Emission Tomography scanner, the main tool used in cancer imaging and diagnosis, with unprecedented time-of-flight coincidence timing resolution and leading to considerable improvement in the image contrast. This has a direct impact on the reduction of the radiotracer radiation dose injected to the patient, on scan time (and consequently patient throughput) and new diagnostic opportunities. The impact of this program also extends beyond PET detectors, since many scientific apparatus and industrial instrumentations will benefit from single photon sensitivity and precise timing measurements, such as Diffuse Optical Tomography, fluorescence imaging, 3D imaging and in apparatus using Light Detection And Ranging (LIDAR) systems. The originality and innovation of the resulting 3D Single Photon Counting Modules represents a timely opportunity for Canada to participate in a high-impact international collaboration with CERN.

光电子系统已成为众多应用的普遍支柱，从智能手机和平板电脑到医疗成像仪器和电信系统。它们在不断发展，性能改进的目标，如增加像素数量，光电探测效率和定时测量精度。智能微系统的集成也提供了持续的增长动力，这些微系统能够处理来自光电探测器的全部或部分信号。按照这种思路，光电子微系统集成和信号处理能力开始利用所需的技术突破，使“超过摩尔定律”在微电子领域。这些技术里程碑之一是3D垂直集成，其中至少有2个集成电路使用硅通孔（TSV）堆叠和互连。该提案是关于3D单光子计数模块的实现，其中光电探测器阵列集成在所需的前端微电子电路之上。目标光电微系统具有单光子探测能力和单光子分辨率，能够以非常高的精度和先进的数字信号处理来标记光子的到达。具有挑战性的目标是实现100 fs至10 ps范围内的定时分辨率。为此，新型光电探测器阵列和读出集成电路在深亚微米CMOS技术是必需的，是本研究计划的短期目标的核心。这项工作将导致下一代检测模块，将用于正电子发射断层扫描扫描仪，癌症成像和诊断中使用的主要工具，具有前所未有的飞行时间符合定时分辨率，并导致图像对比度的显着改善。这对减少注射到患者的放射性示踪剂辐射剂量、扫描时间（以及因此的患者吞吐量）和新的诊断机会具有直接影响。这一计划的影响还超出了PET探测器，因为许多科学仪器和工业仪器将受益于单光子灵敏度和精确的定时测量，如漫射光学断层扫描，荧光成像，3D成像和使用光探测和测距（LIDAR）系统的设备。由此产生的3D单光子计数模块的独创性和创新性为加拿大提供了一个及时的机会，可以参与与CERN的高影响力国际合作。