Three-Dimensional Integration Methodologies for Bio-MOEMS Using Nanobonding Technology

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The scaling benefit of Moore's Law for complementary metal oxide semiconductor (CMOS) technology is limited by the lack of scaling of interconnects and the difficulties in attaching them. We propose the use of interconnects built from carbon nanomaterials and connected using surface activated nanobonding technology. The high current carrying capacity of carbon nanomaterials makes them as an ideal interconnect material for high-speed miniaturized bio-micro-opto-electromechanical systems (Bio-MOEMS). Surface activation refers to the cleaning of native oxides, carbon contaminants and particles from the surface. The surface activated nanobonding method overcomes the attaching difficulties in the current bonding and packaging technologies. This method enables bonding between dissimilar materials at nanometer scale with high bond strength. Also, it requires no external pressure, adhesive, heat, or chemicals. Furthermore, it provides sub-micrometer alignment accuracy, and high electrical and thermal conductivity of the bonded interface. The combination of the above advantages is unique. Therefore, it is an enabling factor for three-dimensional integration, which is required for Bio-MOEMS.The short-term goals of this research program are to comprehensively investigate and develop carbon nanotubes in through silicon vias and graphene on thin oxide of silicon wafers for high-density interconnection. We will also investigate the fundamental science behind their low temperature bonding using the surface activated nanobonding for three-dimensional integration. Using existing research expertise and state-of-art infrastructure, the process developments for the nanointerconnects and surface activated nanobonding will enable the design and development of innovative emerging systems. This proposed research program will provide comprehensive hands-on-training opportunities for high qualified personnel. This will also prepare them for the electronic, micro-electromechanical systems and medical diagnostic industries.