Three-Dimensional Integration Methodologies for Bio-MOEMS Using Nanobonding Technology

互补金属氧化物半导体(CMOS)技术的摩尔定律的规模效益受到互连的缺乏规模和连接困难的限制。我们建议使用由碳纳米材料构建的互连，并使用表面激活纳米键合技术进行连接。碳纳米材料的高载流能力使其成为高速微型化生物微光机电系统(Bio-MOEMS)的理想互连材料。表面活化是指从表面清除天然氧化物、碳污染物和颗粒。表面活化纳米键合方法克服了目前键合和封装技术中的贴合困难。这种方法可以在纳米级实现不同材料之间的结合，并具有很高的结合强度。此外，它不需要外部压力、粘合剂、热量或化学物质。此外，它还提供亚微米级的对准精度，以及粘合界面的高导电性和导热性。上述优势的结合是独一无二的。因此，它是Bio-MOEMS所需的三维集成的使能因素。 这项研究计划的短期目标是全面研究和开发用于高密度互连的硅通孔和硅片薄氧化物上的石墨烯中的碳纳米管。我们还将研究利用表面激活纳米键合进行三维集成的低温键合背后的基础科学。利用现有的研究专业知识和最先进的基础设施，纳米互连和表面激活纳米粘合的工艺开发将使创新的新兴系统的设计和开发成为可能。这一拟议的研究计划将为高素质人员提供全面的动手培训机会。这也将使他们为电子、微型机电系统和医疗诊断行业做好准备。

The scaling benefit of Moore's Law for complementary metal oxide semiconductor (CMOS) technology is limited by the lack of scaling of interconnects and the difficulties in attaching them. We propose the use of interconnects built from carbon nanomaterials and connected using surface activated nanobonding technology. The high current carrying capacity of carbon nanomaterials makes them as an ideal interconnect material for high-speed miniaturized bio-micro-opto-electromechanical systems (Bio-MOEMS). Surface activation refers to the cleaning of native oxides, carbon contaminants and particles from the surface. The surface activated nanobonding method overcomes the attaching difficulties in the current bonding and packaging technologies. This method enables bonding between dissimilar materials at nanometer scale with high bond strength. Also, it requires no external pressure, adhesive, heat, or chemicals. Furthermore, it provides sub-micrometer alignment accuracy, and high electrical and thermal conductivity of the bonded interface. The combination of the above advantages is unique. Therefore, it is an enabling factor for three-dimensional integration, which is required for Bio-MOEMS. The short-term goals of this research program are to comprehensively investigate and develop carbon nanotubes in through silicon vias and graphene on thin oxide of silicon wafers for high-density interconnection. We will also investigate the fundamental science behind their low temperature bonding using the surface activated nanobonding for three-dimensional integration. Using existing research expertise and state-of-art infrastructure, the process developments for the nanointerconnects and surface activated nanobonding will enable the design and development of innovative emerging systems. This proposed research program will provide comprehensive hands-on-training opportunities for high qualified personnel. This will also prepare them for the electronic, micro-electromechanical systems and medical diagnostic industries.