Three-Dimensional Integration Methodologies for Bio-MOEMS Using Nanobonding Technology

摩尔定律对互补金属氧化物半导体（CMOS）技术的扩展效益受到互连缺乏扩展和连接困难的限制。我们建议使用由碳纳米材料构建的互连，并使用表面活化纳米键合技术连接。碳纳米材料的高载流能力使其成为高速小型化生物微光电机电系统（Bio-MOEMS）的理想互连材料。表面活化是指清除表面的天然氧化物、碳污染物和颗粒。表面活化纳米键合方法克服了当前键合和封装技术中的粘接困难。该方法使不同材料之间的结合在纳米尺度上具有较高的结合强度。此外，它不需要外部压力、粘合剂、热量或化学品。此外，它提供了亚微米的对准精度，并提供了高的导电和导热界面。以上优势的结合是独一无二的。因此，它是实现三维集成的有利因素，这是Bio-MOEMS所需要的。

The scaling benefit of Moore's Law for complementary metal oxide semiconductor (CMOS) technology is limited by the lack of scaling of interconnects and the difficulties in attaching them. We propose the use of interconnects built from carbon nanomaterials and connected using surface activated nanobonding technology. The high current carrying capacity of carbon nanomaterials makes them as an ideal interconnect material for high-speed miniaturized bio-micro-opto-electromechanical systems (Bio-MOEMS). Surface activation refers to the cleaning of native oxides, carbon contaminants and particles from the surface. The surface activated nanobonding method overcomes the attaching difficulties in the current bonding and packaging technologies. This method enables bonding between dissimilar materials at nanometer scale with high bond strength. Also, it requires no external pressure, adhesive, heat, or chemicals. Furthermore, it provides sub-micrometer alignment accuracy, and high electrical and thermal conductivity of the bonded interface. The combination of the above advantages is unique. Therefore, it is an enabling factor for three-dimensional integration, which is required for Bio-MOEMS. The short-term goals of this research program are to comprehensively investigate and develop carbon nanotubes in through silicon vias and graphene on thin oxide of silicon wafers for high-density interconnection. We will also investigate the fundamental science behind their low temperature bonding using the surface activated nanobonding for three-dimensional integration. Using existing research expertise and state-of-art infrastructure, the process developments for the nanointerconnects and surface activated nanobonding will enable the design and development of innovative emerging systems. This proposed research program will provide comprehensive hands-on-training opportunities for high qualified personnel. This will also prepare them for the electronic, micro-electromechanical systems and medical diagnostic industries.