Design and optimization of heat dissipation and illumination patterns in novel recessed chip-on-board designs for high-power LED lighting applications

针对高功率 LED 照明应用的新型嵌入式芯片级设计中的散热和照明模式的设计和优化

• 批准号: 521640-2017
• 负责人: Pisana, Simone
• 金额: $ 1.82万
• 依托单位: York University
• 依托单位国家: 加拿大
• 项目类别: Engage Grants Program
• 财政年份: 2017
• 资助国家: 加拿大
• 起止时间: 2017-01-01 至 2018-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=640075
• 关键词: Design; optimization; heat; dissipation; illumination

Thermal management is a fundamental limiting factor in solid state lighting applications, affecting the devicereliability and luminous efficacy. In high-power applications, the increased chip density exacerbates the needfor efficient heat dissipation pathways. Chip-on-board (COB) approaches improved the state of the art byremoving the need to individually package LED chips, while yielding better cooling efficiencies by providing amore intimate thermal contact between the chip and heat sink. However, in COB LED products the flat boarddesign limits the heat spreading that can take place at the interface with heat sinks. A recessed heat sinkcarrying the COB is proposed as an approach to improve the heat spread within the heat sink, and therebyimprove the cooling efficiency of the COB assembly. While the idea is attractive, the design trade-offs in termsof cooling capabilities, recess depth & shape and their impact on the luminous intensity spatial distribution areunknown. Additionally, the recessed heat sink material and relative placement of the phosphor may have anadverse effect on the color output of the light fixture. Systematic studies of heat sink-recessed COB designs canyield insights into these trade-offs and optimum operating points. The research can improve the adoption ofhigh-power solid state lighting in industrial applications, with tremendous environmental benefits, as theincrease in light output per watt consumed greatly reduces energy waste and green-house gas emission fromnon-renewable energy sources.

热管理是固态照明应用中的一个基本限制因素，影响器件的可靠性和发光效率。在高功率应用中，芯片密度的增加加剧了对高效散热路径的需求。板上芯片（COB）方法通过消除单独封装LED芯片的需要而改进了现有技术，同时通过在芯片和散热器之间提供更紧密的热接触而产生更好的冷却效率。然而，在COB LED产品中，平板设计限制了在与散热器的界面处可能发生的热扩散。提出了一种嵌入式散热器的散热方法，以提高散热器内的散热效果，从而提高COB组件的冷却效率。虽然这个想法是有吸引力的，但在冷却能力，凹槽深度和形状以及它们对发光强度空间分布的影响方面的设计权衡是未知的。另外，凹进的散热器材料和磷光体的相对放置可能对灯具的颜色输出具有不利影响。对散热器嵌入式COB设计的系统研究可以深入了解这些权衡和最佳工作点。这项研究可以提高高功率固态照明在工业应用中的应用，并带来巨大的环境效益，因为每瓦消耗的光输出的增加大大减少了能源浪费和不可再生能源的温室气体排放。