Fabrication of Polymer Hollow Microneedles for Transdermal Sample Extraction

用于透皮样品提取的聚合物空心微针的制造

• 批准号: 514392-2017
• 负责人: Cui, Bo
• 金额: $ 0.91万
• 依托单位: University of Waterloo
• 依托单位国家: 加拿大
• 项目类别: Engage Plus Grants Program
• 财政年份: 2017
• 资助国家: 加拿大
• 起止时间: 2017-01-01 至 2018-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=640082
• 关键词: Fabrication; Polymer; Hollow; Microneedles; Transdermal

For transdermal drug delivery, skin fluid and blood extraction, the conventional stainless steel needle causespain to the patients and is hard to be integrated with other medical devices at point-of-care-test fields. Onesolution to those limitations is micro-needle array because of its minimal invasive area/depth causing less painand ability to be integrated with other micro-devices. Moreover, no cases of infection by micro-needles havebeen reported so far. Such micro-needles can be solid or hollow with a length of 100-900 µm and an externaldiameter of not more than 300 µm. The supporting company ExVivo Labs is pioneering novel point-of-caremedical technologies for screening allergies. Its allergy test patches are based on extraction using micro-needlearray of disease indicating biomarkers, such as immunoglobulin-E (IgE), which mediates type I hypersensitivityreactions, known as allergies. In the previous funded Engage project, we aimed to fabricate hollow siliconmicro-needle array using MEMS microfabrication techniques, notably photolithography and deep siliconetching. The fabricated needles will be subsequently sharpened to under 10 micrometers for painless insertioninto skin. In the current Engage Plus project, we aim to fabricate polymer hollow micro-needle array that isadvantageous over silicon in certain aspects.

对于经皮给药、皮肤液体和血液提取，传统的不锈钢针会给患者带来疼痛，并且难以在床旁检测领域与其他医疗设备集成。解决这些局限性的一种方法是微针阵列，因为它的侵入面积/深度最小，导致疼痛更少，并且能够与其他微型设备集成。此外，迄今为止，还没有关于微型针头感染的报告。这种微针可以是实心或空心的，长度为100-900 µm，外径不超过300 µm。支持公司ExVivo Labs正在开创用于筛查过敏症的新型护理点医疗技术。它的过敏测试贴片是基于使用微针提取疾病指示生物标志物，如免疫球蛋白E（IgE），介导I型超敏反应，称为过敏。在之前资助的Engage项目中，我们的目标是使用MEMS微加工技术，特别是光刻和深硅蚀刻来制造中空硅微针阵列。制造的针头随后将被削尖到10微米以下，以便无痛地插入皮肤。在当前的Engage Plus项目中，我们的目标是制造在某些方面比硅更有优势的聚合物空心微针阵列。