Robotic Manipulation for Part Racking Processes in Electroplating Lines

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This Engage project will focus on the investigation of possible methodologies of automating placement of partsto be plated on plating line racks. The utmost aim of doing this investigation is two-fold: (i) precise anddetailed reporting of robotic manipulation needs for KEI plating lines and possible solutions; and (ii) forming abase for follow-up research and development of robotic manipulator systems for racking in such electroplatinglines. The final outputs of the project will be a detailed report on robotic manipulation needs on KEI platinglines and possible solutions, a virtual model and design details of an automated robotic racking system basedon the identified high fidelity system model, and conceptual design of a robotic manipulation system prototype.The obtained virtual system model will also be a key tool for later research studies on development of an actualhigh performance automated robotic system for the use of KEI.