Robotic Manipulation for Part Racking Processes in Electroplating Lines

该Engage项目将重点研究在电镀线机架上自动放置电镀部件的可能方法。做这项调查的最大目的是双重的：(i)精确和详细的报告机器人操作需要KEI电镀线和可能的解决方案；（二）为后续电镀生产线货架机器人操作系统的研发奠定基础。该项目的最终输出将是一份关于KEI镀线上机器人操作需求和可能解决方案的详细报告，基于确定的高保真系统模型的自动机器人货架系统的虚拟模型和设计细节，以及机器人操作系统原型的概念设计。所获得的虚拟系统模型也将成为后续研究开发实际高性能自动化机器人系统的关键工具。

This Engage project will focus on the investigation of possible methodologies of automating placement of partsto be plated on plating line racks. The utmost aim of doing this investigation is two-fold: (i) precise anddetailed reporting of robotic manipulation needs for KEI plating lines and possible solutions; and (ii) forming abase for follow-up research and development of robotic manipulator systems for racking in such electroplatinglines. The final outputs of the project will be a detailed report on robotic manipulation needs on KEI platinglines and possible solutions, a virtual model and design details of an automated robotic racking system basedon the identified high fidelity system model, and conceptual design of a robotic manipulation system prototype.The obtained virtual system model will also be a key tool for later research studies on development of an actualhigh performance automated robotic system for the use of KEI.