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Design and Optimization of Circuit Board Enclosure using Additive Manufacturing Techniques

Design and Optimization of Circuit Board Enclosure using Additive Manufacturing Techniques
使用增材制造技术设计和优化电路板外壳
批准号:
521849-2017
负责人:
Sheikhzadeh, Mehdi
金额:
$1.82万
依托单位国家:
加拿大
项目类别:
Applied Research and Development Grants - Level 1
财政年份:
2017
资助国家:
加拿大
项目状态:
已结题
起止时间:
2017-01-01 至 2018-12-31

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英文摘要
OES Inc. is a leading London, ON based provider of technology solutions in Electronic Manufacturing & Design Services that has developed a system for detection of crimping defects in the production of automotive wiring harnesses, which has benefits in harness reliability. Currently, there are two housings containing sensors and electronics that are custom fabricated and are too costly for volume manufacturing.The proposed project in collaboration with Lambton College's Bluewater Technology Access Centre will investigate the development of a case that can be fabricated by injection moulding that will be much more cost effective and that can be fabricated in volume. The research team will focus on translating the current OES design into one that can be fabricated using injection mouldingThe project will result in accelerating the commercialization cycle for the CQS technology and enable them to economically start shipping demonstration units to global manufacturers of wiring harnesses. The technology will give them a competitive advantage and lower cost will increase the OES market share, allowing them to compete in the cut throat automotive market. This ultimately will provide benefits for Canada, providing economic and exporting impact.
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国内基金
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