3D microscopy from nanoelectronics devices to integrated systems

点击翻译按钮获取中文摘要

We request this grant to enable the acquisition of a confocal microscope for critical and timely morphological characterizations of quantum and nanoelectronic devices, micro-electro-mechanical-systems (MEMS), 2.5D and 3D microsystems, and smart microelectronic packages. This confocal microscope will not only provide us with 3D imagery with the increased XY plane resolution necessary for these applications and unavailable throughstandard optical microscopy, but more importantly permit height measurement in the Z direction with a resolution in the nm range. The requested tool has the following specifications: i) fast imagery of small to large surfaces (µm2 to mm2); ii) 100 nm resolution in XY plane and nanometer scale resolution in Z direction; iii) in-process characterization capability; iv) topography measurements of transparent and reflective surfaces; and v) XY motorized stage with memories capability of automatic image stitching.