Feasibility study for the integration of a microfluidic cooling system and heat spreading on a microelectronics chip

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The transistor miniaturisation for microelectronic chips increases the heat density and generates hot spots that**can alter the chips. Air-cooling systems are becoming insufficient to support this trend, due to their limited**cooling capabilities. Since a few decades, cooling solution involving liquids as coolant has been widely**studied. Those solutions demonstrated a clear advantage to use a liquid to extract heat from the microelectronic**chips, especially when integrated within the microelectronics module. Direct cooling between the chip and the**coolant avoids relying on thermal interfaces, which reduces the efficiency of more classic solutions such as**cooling plates. However, this solution is little or not applied to commercial chips. Its technological**development still meets several obstacles, such as: the integration of non-convectional expertise (pumping**systems, channeling and liquid integration with the packaging, etc.), the absence of standards, and reliability**concerns. Significant challenges are also present in the adaptation of the packaging methods in order to**integrate a fluidic loop.**The objective of this project is to evaluate the relevance and the feasibility of integrating a liquid cooling and**heat spreading system for a product of commercial interest. Various cooling scenarios will be evaluated**analytically and numerically in order to quantify the gain on the thermal resistance, and if it is sufficient to shift**to integrated liquid cooling. Some integration strategies will also be developed to guarantee that its**implementation is possible in an industrial context. So, this partnership with Kontron Canada Inc. will allow to**define the cooling need, and to evaluate the technological acceptability of the proposed solutions.