Visible light integrated photonics on silicon for mixed reality 3D displays

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The past decade has witnessed the dramatic maturation of silicon (Si) photonics – a technology which forms photonic micro/nano-scale devices and photonic integrated circuits on Si substrates using the manufacturing infrastructure of complementary metal oxide semiconductor electronics. The large Si substrates (typically 8” or 12” in diameter) and wafer-scale microelectronic packaging lead to high production volumes that potentially reduce the cost of electro-optical modules. At present, Si photonic technologies, including the integrated waveguide platforms, microfabrication flows, integrated devices, and microsystems, have been developed for the short-wave infrared wavelength range (near 1.3 or 1.5 um) for fiber-optic communications. ******The proposed research program will redefine foundry Si integrated photonics beyond its conventional form to address new applications in the visible wavelength range (around 450-650 nm). In particular, we will investigate visible light photonic integrated circuits (VISPICs) for miniaturized three-dimensional (3D) head-mounted displays (HMDs) for mixed reality (MR) headsets. MR HMDs are an emerging form of wearable computers that seek to create immersive and intuitive human-computer interfaces. However, today's MR HMDs are bulky and non-ergonomic, preventing their widespread adoption. The performance of and experience that can be provided by MR HMDs are largely limited by today's display technology. A radically different approach to HMDs that can be significantly more compact, lightweight, and bright, with a wide angle and large depth of focus is needed.******To address this challenge, we will develop a multi-layer visible light photonic platform on Si to implement novel optical phased array beam scanners for near-eye scanned pixel displays. The photonic platform will contain several moderate refractive index contrast waveguide layers in silicon nitride (SiN) and silicon oxynitride (SiON) with silica cladding layers atop Si. It will be realized on 8” Si substrates in collaboration with a foundry partner. A new 3D architecture for tunable optical phased arrays will be investigated to decrease the array element pitch to suppress radiation side lobes. This research will build upon the remarkable success our group has had in infrared light multi-layer SiN-on-Si photonic platforms, as well as our ongoing research in integrated neurophotonics.******The research program will be transformative for the field of photonics and computing. It will take Si photonics into an application domain with widespread commercial potential that has not traditionally used integrated photonics. It will enable a new type of computer that augments human cognition in a much more integrative way than today's mobile devices. The research program will benefit Canada by stimulating innovation and by training graduate students in technical and transferable skills.