Urgent replacement of a power supply of an electron-beam evaporator for thin films deposition

紧急更换用于薄膜沉积的电子束蒸发器的电源

• 批准号: RTI-2020-00773
• 负责人: LagugnéLabarthet, François
• 金额: $ 4.17万
• 依托单位: University of Western Ontario
• 依托单位国家: 加拿大
• 项目类别: Research Tools and Instruments
• 财政年份: 2019
• 资助国家: 加拿大
• 起止时间: 2019-01-01 至 2020-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=690737
• 关键词: Urgent; replacement; power; supply; electron

Micro and Nanofabrication technologies involve multiple complex steps in an effort to fabricate miniaturized structures and devices with a high degree of reproducibility and quality. Among the steps that are essential to make a functional device, deposition of thin films (metals, dielectric materials) are central to any fabrication of micro and nanoscale devices. An electron beam (ebeam) deposition system is an apparatus where an electron beam is produced under high vacuum environment and focused onto the material to be deposited. The atoms of this target are then ejected by the electron flux and are deposited onto a substrate where the micro and nanostructures are produced. Deposition by electron beam provides a highly controlled rate of deposition resulting in a uniform and pristine surface. This technology allows one to conceive and fabricate a collection of nanoscale features over the surface of a single 4" wafer. In a typical multistep fabrication process, the electron beam deposition system is used repeatedly throughout the sequence. For example, an adhesion layer comprised of titanium or chromium is deposited onto a semiconductor surface prior to deposition of a gold layer. Devices prepared in the Western Nanofabrication Facility typically have 3 or more layers. Layer thickness depends on the role of the layer in the final device and can vary from several nanometers to hundreds of nanometers.***A high quality ebeam deposition system is therefore the key to the success of any advanced fabrication procedure at the nanoscale. The Western Nanofabrication Facility being fully compatible with 4" wafers, wishes to repair and upgrade an ebeam deposition system capable of processing these wafers. The present system operating in the Western Nanofabrication Facility is an open user apparatus and was produced in the 1980's. Although the evaporator chamber and pumping system are in good condition, the power supply and electronics associated with the settings and focusing of the electron beam gun are obsolete and requires regular servicing and repair which conflicts with an extensive use of this instrument. This instrument is one of the busiest machines in the Nanofabrication Facility. Furthermore, its electronics and safety operation are obsolete by today's standards, which emphasizes the urgent need for a replacement for these control elements at a cost much lower than replacing the entire electron beam lithography system. The new beam control and power supply will provide our researchers with advanced capabilities to explore new methods of fabrication of micro and nanoscale devices.

微纳米制造技术包括多个复杂的步骤，以努力制造高度可重复性和高质量的微型化结构和器件。在制造功能器件的关键步骤中，薄膜(金属、介电材料)的沉积是任何微米和纳米器件制造的核心。电子束(电子束)沉积系统是在高真空环境下产生电子束并聚焦到待沉积材料上的设备。然后，这种靶的原子被电子通量喷射出来，并沉积到基片上，在那里产生微结构和纳米结构。电子束沉积提供了高度可控的沉积速度，从而获得了均匀和原始的表面。这项技术允许人们在单个4英寸晶片的表面构思和制造一组纳米级的特征。在典型的多步骤制造过程中，电子束沉积系统在整个序列中重复使用。例如，在沉积金层之前，在半导体表面上沉积由钛或铬组成的粘附层。在西方纳米加工设施中制备的器件通常具有3层或更多层。层的厚度取决于层在最终设备中的作用，可以从几纳米到数百纳米不等。*因此，高质量的电子束沉积系统是任何先进的纳米级制造过程成功的关键。西方纳米加工设施与4英寸晶片完全兼容，希望修复和升级能够处理这些晶片的电子束沉积系统。目前在西部纳米加工设施运行的系统是一种开放式设备，生产于20世纪80年代的S。虽然蒸发室和抽气系统状况良好，但与电子束枪的设置和聚焦相关的电源和电子设备陈旧，需要定期维护和维修，这与该仪器的广泛使用相冲突。该仪器是纳米加工设施中最繁忙的机器之一。此外，它的电子学和安全操作在今天的标准下已经过时，这强调了迫切需要以远低于更换整个电子束光刻系统的成本更换这些控制元件。新的光束控制和电源将为我们的研究人员提供先进的能力，以探索制造微米和纳米级器件的新方法。