Silicon interposer prototyping for nEXO

nEXO实验是寻找136氙的无中微子双β衰变的下一代实验。美国能源部正在加大对R的支持力度，以开发一种基于德国柏林弗劳恩霍夫可靠性和微集成研究所（IZM）硅中介层技术的“全硅”瓦（10 × 10平方厘米）解决方案。硅是仅有的两种材料之一（与石英一起），似乎是足够的辐射纯用于SiPM瓷砖。硅还具有与同样由硅制成的SiPM完美热匹配的优点。我们打算在下一次CFI创新基金竞赛中申请资金，用于建造nEXO光电探测器平面。该提案旨在支持在CFI资金可用之前，在加拿大开发nEXO瓷砖的专业知识和能力。* 我们提出的内插器开发将用于U.Sherbrooke和TRIUMF开发的数字SiPM（3DdSiPM）的原型瓦片，作为基线模拟SiPM解决方案的高性能替代方案。微电子研究所（IME，中国北京）正在开发一种用于模拟SiPM的内插器，但传输线规格与内插器上的数字电子器件的操作不兼容。3DdSiPM和模拟SiPM之间的竞争非常激烈，但如果3DdSiPM到2021年达到所需的性能，我们就有机会让nEXO采用这项技术。与模拟SiPM相比，3DdSiPM在机械和电气集成到瓦片上时预计会大放异彩，因为大多数信号处理都发生在3DdSiPM内。有了这个建议，我们的目标是建立一个3DdSiPM瓷砖，以证明3DdSiPM是真正的上级，特别是当考虑大规模集成问题。* 最后，硅中介层技术作为连接大型硅探测器的一种手段，可能会在液体氙中光子探测之外找到应用。它当然非常适合用于液态氩（DUNE，暗物质搜索），前提是它具有成本效益。与硅像素探测器相关的技术也可能被证明是令人信服的。因此，这是一项在亚原子物理学中有着广泛应用的新技术。这项拨款申请是一个及时的机会，加拿大发挥先锋作用，在出现这种技术用于亚原子物理学。********

The nEXO experiment is a next generation experiment searching for neutrino-less double beta decay of 136Xenon. The US Department of Energy is ramping up its support of the R to develop an “all silicon” tile (10x10cm^2) solution based on silicon interposer technology of the Fraunhofer Institute for reliability and micro-integration (IZM) in Berlin, Germany. Silicon is one of the only two materials (together with quartz) that appears to be sufficiently radiopure to be used for the SiPM tile. Silicon has also the advantage of perfect thermal matching with the SiPMs that are also made of silicon. We intend to request funds in the next CFI Innovation Fund competition for the construction of nEXO photo-detector plane. This proposal is to support the development of expertise and capabilities for the construction of nEXO tiles in Canada before CFI funds become available. ***The interposer development that we are proposing will be used to prototype tiles of the digital SiPMs (3DdSiPM) being developed by U.Sherbrooke and TRIUMF as an high performance alternative to the baseline analog SiPM solution. The Institute of Micro-Electronics (IME, Beijing, China) is developing an interposer for analog SiPMs but the transmission line specifications are not compatible with the operation of digital electronics on the interposer. The competition between 3DdSiPMs and analog SiPMs is fierce, yet we have a window of opportunity for nEXO to adopt this technology if 3DdSIPMs achieve the required performances by 2021. 3DdSiPMs are expected to shine compared to analog SiPM when it comes to mechanical and electrical integration onto tiles as most of the signal processing occurs within the 3DdSiPMs. With this proposal, our aim is to build a 3DdSiPM tile in order to demonstrate that 3DdSiPMs are truly superior especially when considering large scale integration issue. ***Finally, the silicon interposer technology as a mean of connecting large silicon detectors is likely to find applications outside the detection of photons in liquid Xenon. It would certainly be well suited for use in liquid Argon (DUNE, Dark matter search) provided that it is cost effective. It may also prove compelling associated with silicon pixel detectors. Therefore it is a new technology that may find a wide range of applications in subatomic physics. This grant application is a timely opportunity for Canada to play a pioneering role in the emergence of this technology for use in subatomic physics. ********