Compact and Energy Efficient Wireless Microelectromechanical Sensing Systems

紧凑且节能的无线微机电传感系统

• 批准号: RGPIN-2016-04871
• 负责人: Nabki, Frederic
• 金额: $ 2.26万
• 依托单位: École de technologie supérieure
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2020
• 资助国家: 加拿大
• 起止时间: 2020-01-01 至 2021-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=708927
• 关键词: Compact; Energy; Efficient; Wireless; Microelectromechanical

Like integrated circuits (ICs), microelectromechanical systems (MEMS) are a disruptive technology, enhancing systems and enabling new applications. The MEMS market is expanding at an increasing rate, projected to almost double from $11B in 2014 to $21B in 2020 [Yole, 2015]. Recently, MEMS sensors have had an increased presence, notably in wearables (e.g. smartwatches, fitness trackers) and sensor nodes (e.g. tracking, weather forecasting), where many sensors are combined. This warrants tighter integration to allow for more compact systems, and requires wireless interfaces to transmit sensor telemetry and allow for more mobility. Such sensors are suited to the upcoming Internet-of-Things, where large numbers of small and autonomous sensor nodes, independent of power and wiring infrastructure, are expected to be deployed with a much reduced deployment overhead. ICs can enable the circuitry required within such compact MEMS sensors. However, single-package integration with multiple MEMS remains difficult because of microfabrication process incompatibilities and specific design intricacies. Furthermore, energy efficiency is becoming a key challenge to system integration, as there is a strong push to deploy sensors into devices with smaller batteries, having insufficient energy capacity for the desired functionalities. Efficiency can be improved by reducing the power consumption of the wireless and interface electronics, and enhancing the sensor with energy harvesters. Accordingly, the vision of this research program is to integrate traditionally disjointed functions of sensing systems (i.e., transducer, sensing interface, wireless communication, and energy source) within a single package or, ultimately, a single die. Prof. Nabki will use his research expertise, recent progress and unique MEMS, ICs and integration technologies to attain this vision by pursuing 3 short term research objectives: i) elaborate MEMS transducers well-suited to above-IC integration and to transducer fusion; ii) investigate highly energy-efficient sensing interfaces and wireless communication ICs; and iii) explore hybrid mechanical energy harvesters to increase sensor energy efficiency. Ultimately, this research program will facilitate the creation of low-cost, small form factor wireless sensors that can be used in a variety of environments and applications, yielding advances in the fields of MEMS, energy harvesting, sensing, low-power ICs and integration, which represent significant contributions to research in Canada. These new sensors will have an overarching applicability and impact in sectors such as transportation, healthcare, environment and industrial processes, strengthening Canada's competitiveness. The 10 HQP trained during the research program (2 BEng, 3 MASc, 5 PhD) will gain valuable and marketable advanced manufacturing and design skills for the Canadian economy.

与集成电路（IC）一样，微机电系统（MEMS）是一种颠覆性技术，可以增强系统并实现新的应用。MEMS市场正在以越来越快的速度扩张，预计将从2014年的110亿美元增加到2020年的210亿美元，几乎翻了一番[Yole，2015]。最近，MEMS传感器的应用越来越多，特别是在可穿戴设备（例如智能手表，健身追踪器）和传感器节点（例如跟踪，天气预报）中，其中许多传感器被组合在一起。这保证了更紧密的集成以允许更紧凑的系统，并且需要无线接口来传输传感器遥测并允许更多的移动性。这种传感器适合即将到来的物联网，其中大量的小型和自主的传感器节点，独立于电力和布线基础设施，预计将以大大减少的部署开销进行部署。 IC可以实现这种紧凑型MEMS传感器内所需的电路。然而，由于微细加工工艺不兼容性和特定设计的复杂性，与多个MEMS的单封装集成仍然很困难。此外，能源效率正在成为系统集成的关键挑战，因为有强大的推动力将传感器部署到具有较小电池的设备中，这些设备的能量容量不足以实现所需的功能。可以通过降低无线和接口电子设备的功耗以及增强具有能量采集器的传感器来提高效率。 因此，这项研究计划的愿景是整合传感系统的传统脱节功能（即，换能器、感测接口、无线通信和能量源）在单个封装内或最终在单个管芯内。Nabki教授将利用他的研究专长、最新进展和独特的MEMS、IC和集成技术，通过追求3个短期研究目标来实现这一愿景：i）精心制作适合集成电路集成和传感器融合的MEMS传感器; ii）研究高能效的传感接口和无线通信IC; iii）探索混合机械能量采集器，以提高传感器的能效。 最终，该研究计划将促进创建低成本，小尺寸无线传感器，可用于各种环境和应用，在MEMS，能量收集，传感，低功耗IC和集成等领域取得进展，这对加拿大的研究做出了重大贡献。这些新传感器将在运输、医疗保健、环境和工业流程等领域产生广泛的适用性和影响，从而增强加拿大的竞争力。在研究计划期间培训的10名HQP（2名工程学士，3名硕士，5名博士）将为加拿大经济获得有价值和有市场的先进制造和设计技能。