Compact and Energy Efficient Wireless Microelectromechanical Sensing Systems

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Like integrated circuits (ICs), microelectromechanical systems (MEMS) are a disruptive technology, enhancing systems and enabling new applications. The MEMS market is expanding at an increasing rate, projected to almost double from $11B in 2014 to $21B in 2020 [Yole, 2015]. Recently, MEMS sensors have had an increased presence, notably in wearables (e.g. smartwatches, fitness trackers) and sensor nodes (e.g. tracking, weather forecasting), where many sensors are combined. This warrants tighter integration to allow for more compact systems, and requires wireless interfaces to transmit sensor telemetry and allow for more mobility. Such sensors are suited to the upcoming Internet-of-Things, where large numbers of small and autonomous sensor nodes, independent of power and wiring infrastructure, are expected to be deployed with a much reduced deployment overhead. ICs can enable the circuitry required within such compact MEMS sensors. However, single-package integration with multiple MEMS remains difficult because of microfabrication process incompatibilities and specific design intricacies. Furthermore, energy efficiency is becoming a key challenge to system integration, as there is a strong push to deploy sensors into devices with smaller batteries, having insufficient energy capacity for the desired functionalities. Efficiency can be improved by reducing the power consumption of the wireless and interface electronics, and enhancing the sensor with energy harvesters. Accordingly, the vision of this research program is to integrate traditionally disjointed functions of sensing systems (i.e., transducer, sensing interface, wireless communication, and energy source) within a single package or, ultimately, a single die. Prof. Nabki will use his research expertise, recent progress and unique MEMS, ICs and integration technologies to attain this vision by pursuing 3 short term research objectives: i) elaborate MEMS transducers well-suited to above-IC integration and to transducer fusion; ii) investigate highly energy-efficient sensing interfaces and wireless communication ICs; and iii) explore hybrid mechanical energy harvesters to increase sensor energy efficiency. Ultimately, this research program will facilitate the creation of low-cost, small form factor wireless sensors that can be used in a variety of environments and applications, yielding advances in the fields of MEMS, energy harvesting, sensing, low-power ICs and integration, which represent significant contributions to research in Canada. These new sensors will have an overarching applicability and impact in sectors such as transportation, healthcare, environment and industrial processes, strengthening Canada's competitiveness. The 10 HQP trained during the research program (2 BEng, 3 MASc, 5 PhD) will gain valuable and marketable advanced manufacturing and design skills for the Canadian economy.