Compact and Energy Efficient Wireless Microelectromechanical Sensing Systems

紧凑且节能的无线微机电传感系统

• 批准号: RGPIN-2016-04871
• 负责人: Nabki, Frederic
• 金额: $ 2.26万
• 依托单位: École de technologie supérieure
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2020
• 资助国家: 加拿大
• 起止时间: 2020-01-01 至 2021-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=708927
• 关键词: Compact; Energy; Efficient; Wireless; Microelectromechanical

Like integrated circuits (ICs), microelectromechanical systems (MEMS) are a disruptive technology, enhancing systems and enabling new applications. The MEMS market is expanding at an increasing rate, projected to almost double from $11B in 2014 to $21B in 2020 [Yole, 2015]. Recently, MEMS sensors have had an increased presence, notably in wearables (e.g. smartwatches, fitness trackers) and sensor nodes (e.g. tracking, weather forecasting), where many sensors are combined. This warrants tighter integration to allow for more compact systems, and requires wireless interfaces to transmit sensor telemetry and allow for more mobility. Such sensors are suited to the upcoming Internet-of-Things, where large numbers of small and autonomous sensor nodes, independent of power and wiring infrastructure, are expected to be deployed with a much reduced deployment overhead. ICs can enable the circuitry required within such compact MEMS sensors. However, single-package integration with multiple MEMS remains difficult because of microfabrication process incompatibilities and specific design intricacies. Furthermore, energy efficiency is becoming a key challenge to system integration, as there is a strong push to deploy sensors into devices with smaller batteries, having insufficient energy capacity for the desired functionalities. Efficiency can be improved by reducing the power consumption of the wireless and interface electronics, and enhancing the sensor with energy harvesters. Accordingly, the vision of this research program is to integrate traditionally disjointed functions of sensing systems (i.e., transducer, sensing interface, wireless communication, and energy source) within a single package or, ultimately, a single die. Prof. Nabki will use his research expertise, recent progress and unique MEMS, ICs and integration technologies to attain this vision by pursuing 3 short term research objectives: i) elaborate MEMS transducers well-suited to above-IC integration and to transducer fusion; ii) investigate highly energy-efficient sensing interfaces and wireless communication ICs; and iii) explore hybrid mechanical energy harvesters to increase sensor energy efficiency. Ultimately, this research program will facilitate the creation of low-cost, small form factor wireless sensors that can be used in a variety of environments and applications, yielding advances in the fields of MEMS, energy harvesting, sensing, low-power ICs and integration, which represent significant contributions to research in Canada. These new sensors will have an overarching applicability and impact in sectors such as transportation, healthcare, environment and industrial processes, strengthening Canada's competitiveness. The 10 HQP trained during the research program (2 BEng, 3 MASc, 5 PhD) will gain valuable and marketable advanced manufacturing and design skills for the Canadian economy.

与集成电路（ic）一样，微机电系统（MEMS）是一种颠覆性技术，可以增强系统并实现新的应用。MEMS市场正在以越来越快的速度扩张，预计将从2014年的110亿美元增长到2020年的210亿美元，几乎翻倍[Yole， 2015]。最近，MEMS传感器的存在越来越多，特别是在可穿戴设备（例如智能手表，健身追踪器）和传感器节点（例如跟踪，天气预报）中，其中许多传感器组合在一起。这保证了更紧密的集成，以实现更紧凑的系统，并需要无线接口来传输传感器遥测数据，并允许更多的移动性。这种传感器适用于即将到来的物联网，在物联网中，大量小型和自主的传感器节点，独立于电源和布线基础设施，预计将大大减少部署开销。