基于贴体热成形的准三维表面顺形电子新的制造方法的研究

继可拉伸电子之后，三维、准三维的表面顺形电子是最近两年在柔性电子制造方面出现的一个新的方向。已有的工作中存在很多的挑战：加工中存在界面滑移、剥离、屈曲翘曲导致失效，图案化金属操作、转移低效，加工过程繁琐对环境不友好等问题。本研究中针对以上问题，引进新的力学缓存层，减小由应力引起的失效问题，新的高效的金属图案化方方法以及操作转移，减少相应环节和对环境的危害。具体来讲，本研究主要是通过引进新的策略、材料、工艺，运用理论分析、软件仿真、实验验证等手段阐明其背后的机理、其间的相互影响、控制规律，并由此找到具体实现方法、优化具体工艺参数，形成一套切实可行的方案、理论和加工方法，以期高效可靠地制造三维、准三维的表面顺形电子，并对理解可拉伸电子内部力学行为，发展和完善其加工工艺提供一定的指导作用和全新的视角。

After stretchable electronics, 2.5D/3D conformal electronics is an emerging research field in flexible electronics. However, there are a lot challenges in such kind of research: the stress induced delamination, interface skid and further yield curving; low effective manipulation and transfer of patterned metals; and tedious fabrication process, non environmentally friendly and so. In this research, we will try to solve such problems by introducing new mechanical buffer layer to minimize the induced stress, new effective directly pattern and adhesive transfer of metal to simplify the tedious process and achieve environmentally friendly. Specifically, in this research, by introducing new strategy, material, fabrication process, using theoretical analysis, numerical simulation, experimental verification, we will try to find the mechanics behind these issues. Further, based on the above results, we will build up a new theory and process targeting highly efficient fabrication of 2.5D/3D conformal electronics. Ultimately, this will help us to find a new perspective to understand the mechanical behaviour in stretchable electronic and further guide us to improve the fabrication process for such kind of electronics.