Fabrication of GaN-Based Heterostructures with an InAlGaN/AlGaN Composite Barrier
Fabrication of GaN-Based Heterostructures with an InAlGaN/AlGaN Composite Barrier
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具有 InAlGaN/AlGaN 复合势垒的 GaN 基异质结构的制造
DOI:
10.1088/0256-307x/33/8/088102
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发表时间:
2016-08
影响因子:
3.5
通讯作者:
Zhang JC
中科院分区:
文献类型:
--
作者:
Quan Ru-Dai;Zhang Jin-Cheng;Xue Jun-Shuai;Zhao Yi;Ning Jing;Lin Zhi-Yu;Zhang Ya-Chao;Ren Ze-Yang;Hao Yue;Zhang JC
GaN-based heterostructures with an InAlGaN/AlGaN composite barrier on sapphire (0001) substrates are grown by a low-pressure metal organic chemical vapor deposition system. Compositions of the InAlGaN layer are determined by x-ray photoelectron spectroscopy, structure and crystal quality of the heterostructures are identified by high resolution x-ray diffraction, surface morphology of the samples are examined by an atomic force microscope, and Hall effect and capacitance-voltage measurements are performed at room temperature to evaluate the electrical properties of heterostructures. The Al/In ratio of the InAlGaN layer is 4.43, which indicates that the InAlGaN quaternary layer is nearly lattice-matched to the GaN channel. Capacitance–voltage results show that there is no parasitic channel formed between the InAlGaN layer and the AlGaN layer. Compared with the InAlGaN/GaN heterostructure, the electrical properties of the InAlGaN/AlGaN/GaN heterostructure are improved obviously. Influences of the thickness of the AlGaN layer on the electrical properties of the heterostructures are studied. With the optimal thickness of the AlGaN layer to be 5 nm, the 2DEG mobility, sheet density and the sheet resistance of the sample is 1889.61 cm2/V s, 1.44 × 1013 cm−2 and as low as 201.1 ω/sq, respectively.
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