Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications
Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications
复制标题
用于散热应用的液相剥离石墨烯基薄膜的表征和模拟
DOI：
10.1016/j.carbon.2016.05.014
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发表时间：
2016-09
期刊：
影响因子：
10.9
通讯作者：
Johan Liu
中科院分区：
文献类型：
--
作者：
Yong Zhang;Johan Liu
本文关注石墨烯基薄膜的热性能，用于散热应用。采用真空抽滤和滴涂两种不同的方法制备了液相剥离（LPE）膜。在1200 W/cm 2的热通量密度下，真空过滤膜和滴涂膜的温度分别降低了6 °C和4 °C。本文首次将三种不同的方法结合起来评估和预测这种石墨烯基薄膜的热性能。使用电阻温度计来监测由于使用基于石墨烯的散热器而导致的热点温度降低相对于焦耳热流。采用3ω法对薄膜的面内和面间热导率进行了实验测定。热点测试结构的有限元模型使用从3ω测量获得的面内和贯穿面热导率（分别为110和0.25 W/mK）来设置。进行模拟以预测热点温度降低，在所有方法之间获得极好的一致性。结果表明，石墨烯基薄膜的取向和纯度，以及它们相对于芯片的热边界电阻，是确定石墨烯基散热器的热性能时的关键参数。
This paper concerns the thermal properties of graphene-based films for heat spreading applications. Following liquid phase exfoliation (LPE) films were made by two different methods, vacuum filtration and drop coating. Temperature decreases of up to 6 °C and 4 °C were measured at a heat flux density of 1200 W/cm2for the vacuum filtrated and drop coated films respectively. For the first time in this paper, three different methods were combined to evaluate and predict the thermal performance of such graphene-based films. Resistance thermometers were used to monitor the hotspot temperature decrease versus the Joule heat flow as a result of using graphene-based heat spreaders. The 3ω method was used to experimentally determine the in-plane and through-plane thermal conductivities of such films. A finite element model of the hotspot test structure was setup using the in-plane and through-plane thermal conductivities (110 and 0.25 W/mK, respectively) obtained from the 3ω measurements. Simulations were performed to predict the hotspot temperature decrease with excellent agreement obtained between all methods. The results indicate that the alignment and purity of the graphene-based films, as well as their thermal boundary resistance with respect to the chip, are key parameters when determining the thermal performance of graphene-based heat spreaders.
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DOI：
10.1109/itherm.2010.5501372
发表时间：
2010-06
期刊：
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
影响因子：
--
作者：
S. Subrina;D. Kotchetkov;A. Balandin
通讯作者：
S. Subrina;D. Kotchetkov;A. Balandin
影响因子：
56.9
作者：
Lin, Y. -M.;Dimitrakopoulos, C.;Avouris, Ph.
通讯作者：
Avouris, Ph.
影响因子：
38.3
作者：
Hernandez, Yenny;Nicolosi, Valeria;Coleman, Jonathan N.
通讯作者：
Coleman, Jonathan N.
影响因子：
64.8
作者：
Kim, Keun Soo;Zhao, Yue;Hong, Byung Hee
通讯作者：
Hong, Byung Hee
影响因子：
10.8
作者：
Balandin, Alexander A.;Ghosh, Suchismita;Lau, Chun Ning
通讯作者：
Lau, Chun Ning